Some features pertain to a substrate that includes a first portion of the substrate including a first plurality of metal layers, a second portion of the substrate including a second plurality of metal layers, and a plurality of insulating layers configured to separate the first plurality of metal layers and the second plurality of metal layers. A first plurality of posts and a plurality of interconnects are coupled together such that the first plurality of posts and the plurality of interconnects couple the first portion of the substrate to the second portion of the substrate.

A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability. A method includes transferring solder paste on to a bottom PCB and forming a bottom PCBA by placing SMT components on the bottom PCB. A middle PCB is stacked on the bottom PCBA and solder paste is transferred on to the middle PCB. A top PCB is stacked on the middle PCB and solder paste is transferred on to the top PCB. SMT components are placed on the top PCB to form a stacked assembly. The stacked assembly is reflowed in a single reflow so that all solder paste simultaneously or nearly simultaneously melts to bond SMT components to respective PCB boards and to bond respective PCBs to each other.

Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

A substrate structure is provided. The substrate structure includes a substrate, a first redistribution structure, a first adhesive layer and a first connecting component. The substrate includes a first conductor on a first surface thereof. The first redistribution structure is disposed over the substrate. The first adhesive layer is disposed between the substrate and the first redistribution structure. The first connecting component is electrically connected with the first conductor, penetrates through the first adhesive layer into the first redistribution structure, and electrically connects the substrate to the first redistribution structure.

Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.

A honeycomb core includes a honeycomb substrate comprised of a number of sheets. A number of traces are printed onto the sheets of the honeycomb substrate. A number of integrated electronic devices are disposed within the honeycomb substrate. The integrated electronic devices are electrically coupled to the traces.

A multilayer board insulating sheet contains a reducing agent.

An electrode connecting method includes: producing (i) a first circuit board including first electrodes spaced at a first distance and (ii) a second circuit board having a thermal expansion rate less than that of the first circuit board and including second electrodes spaced at a second distance, such that a difference in dimension between the first distance and the second distance falls within a particular permissible range; dehydrating the first circuit board so as to reduce the first distance; causing the first electrodes and the second electrodes to be respectively opposed to each other, with a thermosetting adhesive interposed between the first circuit board and the second circuit board; heating the thermosetting adhesive and at least the first circuit board of the first circuit board and the second circuit board; and bringing the first circuit board and the second circuit board into pressing contact with each other.