A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.

A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is ½ or more and 5 or less.

A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A printed wiring board includes: a first insulating layer having a first surface and a second surface opposite from the first surface; a second insulating layer stacked on the first surface of the first insulating layer; and a conductor wiring interposed between the first insulating layer and the second insulating layer. The first insulating layer contains a liquid crystal polymer. The second insulating layer contains a cured product of a thermosetting composition, containing an inorganic filler and a thermosetting component, and a fibrous base member. A temperature, at which a decrease in the mass of the second insulating layer that has had its temperature increased at a temperature increase rate of 10° C./min from an initial-state temperature of 25° C. reaches 5% of its initial-state mass, is equal to or higher than 355° C.

At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.

A printed circuit board includes an insulating body, a wiring structure at least disposed on the insulating body; and a shielding portion including a conductive via disposed around the wiring structure of the insulating body. The conductive via includes first and second metal layers having different degrees of magnetic permeability.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.