In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

A display device production method is a production method in which, after a layered body including a resin layer, a TFT layer, and a light emitting element layer is formed on a substrate that is transparent, a lower face of the resin layer is irradiated with laser from a reverse face of the substrate using a laser peeling device, and the substrate is peeled from the layered body. The display device production method includes measuring an optical characteristic of the substrate that is peeled off, and performing predetermined processing in a case that a measurement result exceeds a threshold value.

A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.

A multi-layer circuit board is formed by positioning a top sub having traces on at least one side to one or more pairs of composite layers, each composite layer comprising an interposer layer and a sub layer. Each sub layer which is adjacent to an interposer layer having an interconnection aperture, the interconnection aperture positioned adjacent to interconnections having a plated through via or pad on each corresponding sub layer. Each interposer aperture is filled with a conductive paste, and the stack of top sub and one or more pairs of composite layers are placed into a lamination press, the enclosure evacuated, and an elevated temperature and laminated pressure is applied until the conductive paste has melted, connecting the adjacent interconnections, and the boards are laminated together into completed laminated multi-layer circuit board.

Methods and systems for providing a user with content relevant to a location of interest to the user, when the user is determined to be at or near the location, are presented. The user's interest in the location may be determined based on queries about the location received from the user prior to the user arriving at the location. The queries received from the user about the location are used to build a location recommendation model, which generates personalized content relevant to the location and to one or more interest verticals identified for the user. The location recommendation model is built using a location recommendation engine that collects data about the user, the queried location, one or more associations between the user, the queried location, and/or one or more other users, as well as various other information related to the user's interests and the queried location.

A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 m or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.

A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from 1/4 to 3/4, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within 20 C. of a glass transition temperature of the inner insulating layer.