Embodiments of the present invention relate to transponder fabrication. In an embodiment, a plurality of antenna elements is applied to a first substrate at a first pitch. A plurality of fully functioning first transponders is positioned on to the first substrate in a manner to each be in electrical communication with an antenna element included in the plurality of antenna elements and thereby forms a plurality of fully functioning second transponders. The plurality of fully functioning first transponders are positioned on a second substrate at a second pitch. The plurality of fully functioning first transponders have a first read range. Second transponders have an increased read range relative to second transponders. The second pitch is greater than the first pitch.

A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The at least one lower dielectric layer of the lower conductive structure is substantially free of glass fiber. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

A package substrate including a redistribution structure and a core is provided. The redistribution structure has a first redistribution surface and a bonding pad disposed on the first redistribution surface. The core is disposed on the redistribution structure and has a first core surface facing towards the first redistribution surface of the redistribution structure. The core has a first core pad disposed on the first core surface and directly bonded to the bonding pad, and the first core pad is offset from the bonding pad. A package structure is also provided.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

Disclosed herein may be an apparatus and method for detecting ion migration. The apparatus may include: a first printed circuit board (PCB) pad coupled with a ground; a second PCB pad disposed at a position spaced apart from the first PCB pad; a power supply unit configured to supply power to the second PCB pad; a voltage detection unit configured to detect a voltage of an output terminal of the first PCB pad; and a control unit configured to determine whether ion migration has occurred between the first PCB pad and the second PCB pad using the voltage detected by the voltage detection unit.

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.

Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.

The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

A composite substrate includes a flat cable and a mounting board. The flat cable includes a first end portion and a second end portion, and a first bonding portion, a circuit portion, and a second bonding portion in this order in the length direction from the first end portion toward the second end portion. A positioning hole is disposed between the first end portion and the first bonding portion in the length direction. Another positioning hole is disposed between the second end portion and the second bonding portion in the length direction. The mounting board includes a mounting land conductor and a convex portion. The convex portion is fitted in the positioning hole. The mounting land conductor is bonded by surface mounting to an external connection conductor of the first bonding portion and an external connection conductor of the second bonding portion.