A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.

A laminated substrate includes: a first substrate; a second substrate having a through-hole; a third substrate; a first adhesive layer bonding a rear surface of the first substrate and a front surface of the second substrate; a second adhesive layer bonding a rear surface of the second substrate and a front surface of the third substrate; a first post penetrating through the first adhesive layer, electrically connecting the first substrate to the second substrate, and made of an alloy of a high melting point metal and a low melting point metal; a second post penetrating through the second adhesive layer, electrically connecting the second substrate to the third substrate, and made of an alloy of the high melting point metal and the low melting point metal; and an electronic component fixed to the front surface of the third substrate and disposed in the through-hole of the second substrate.

A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

A method for producing a resin multilayer board includes preparing a first resin layer including one or more conductor patterns that are disposed thereon and a conductor pattern including a first region that is to be connected to a conductor via; forming a paint layer by applying a paste including a LCP powder to a second region entirely covering the one or more conductor patterns; forming a cavity in the paint layer such that at least the first region is exposed, by performing laser processing; stacking a second resin layer including the conductor via on the first resin layer; and obtaining a resin multilayer board including a layer obtained by curing the paint layer, by applying pressure and heat to the multilayer body to perform thermal pressure-bonding.

Disclosed is a wiring board having at least one insulating layer and at least one wiring layer arranged to overlap the insulating layer. The insulating layer includes: an arrangement portion at which the wiring layer is arranged; and a side wall portion which surrounds at least a part of the wiring layer arranged at the arrangement portion in a plane direction. The side wall portion has a planar shape that restricts movement and rotation of the wiring layer in the plane direction.

A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

A wiring board includes: a connection pad; an insulating layer that covers the connection pad and has an opening portion exposing a portion of the connection pad; and a metal pin that is disposed on the insulating layer and that is connected to the connection pad through a metal bonding material provided in the opening portion. The opening portion includes a main opening portion, and a plurality of protrusive opening portions that communicate with the main opening portion and that protrude outward from an outer circumference of the main opening portion. An outer circumference of a lower end surface of the metal pin, which is opposed to the insulating layer, is located outside the outer circumference of the main opening portion.

A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The redistribution layer is disposed on the first surface. The chip and the conductive pillars are disposed on the redistribution layer. The molding compound covers the chip, the conductive pillars, and the redistribution layer. The circuit board is connected with the carrier board, wherein the circuit board is disposed on the molding compound, such that the chip is located between the substrate and the circuit board, and the chip and the redistribution layer are electrically connected with the circuit board through the conductive pillars. Heat generated by the chip is transmitted through the substrate from the first surface to the second surface to dissipate.

A wiring substrate includes a first wiring layer on a surface of a first insulating layer; a via interconnect including a first portion connected to the first wiring layer and a second portion formed monolithically with the first portion and extending from an end of the first portion in a direction away from the first wiring layer; a second insulating layer on the first insulating layer; and a second wiring layer on the second insulating layer, contacting a first surface of the second portion. The area of a cross section of the first portion, parallel to the surface of the first insulating layer, increases as the position of the cross section approaches the first wiring layer from the second portion. The second portion includes a second surface that is opposite from its first surface and extends horizontally from the end of the first portion to overhang the first portion.