Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.

A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

A method for manufacturing a circuit board with embedded conductive circuits includes providing a first circuit substrate having a first support board and a first peelable film, providing a second circuit substrate having a second support board and a second peelable film, providing an insulating layer to obtain an intermediate body, pressing the intermediate body, and removing the first support board, the first peelable film, the second support board, and the second peelable film. The first circuit substrate includes a first circuit layer. The second circuit substrate includes a second circuit layer. The first circuit layer is electrically coupled to the second circuit layer through the insulating layer.

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

[Summary]

The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

A piezochromic stamp is provided, wherein when a pressing side of the piezochromic stamp is subjected to a pressure, a light transmittance effect of the pressing side is changed from allowing a light having a specific wavelength to pass through to blocking the light having the specific wavelength, or the light transmittance effect of the pressing side is changed from blocking the light having the specific wavelength to allowing the light having the specific wavelength to pass through.

The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.

A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.