A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.

In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer.

A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed.

In one aspect the present disclosure relates to a 3D printed signal control backbone apparatus. The apparatus may have a filament including a first material section and a plurality of second material sections. The first material section is bounded on opposing ends by the second material sections. The first material section is formed by an ink having a percolating network of a plurality of chiplets infused in a non-conductive polymer. The plurality of chiplets form electrically responsive elements imparting a predetermined logic function and which are responsive to a predetermined electrical signal. The second material sections are formed by an ink which is electrically conductive.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.

A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.

The examples set forth herein involve inkjet printing one or more layers on a multilayer ceramic base. In some examples, the multilayer ceramic base is fired in a first firing process before one or more inkjet printed layers are printed on the multilayer ceramic base to form a combination package comprising the multilayer ceramic base and the one or more inkjet printed layers. In further examples, the combination package is fired in a second firing process.