An apparatus for manufacturing a printed circuit board having a substrate with an upper and a lower surfaces is disclosed. The apparatus is configured to implement a stacking operation disposing a first insulating material and a second insulating material on the upper and the lower surfaces of the substrate respectively. The apparatus includes a stacking operation table with a first and a second sides, a first measuring table and a first transporting device. The first measuring table is disposed adjacent to the first side of the stacking operation table, and has a first and a second image sensing elements disposed at a pair of diagonal corners. The first transporting device is movably disposed on a location higher than the stacking operation table and the first measuring table to transport the first and the second insulating materials to the first measuring table and then to the stacking operation table sequentially.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an ideal conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an ideal conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being played back during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an ideal conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being played back during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.

A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad which is further to carry on surface treatment on the at least one welding pad to form a protective layer; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate.

A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.

A multi-layer circuit structure including a core layer, a first circuit structure, a second circuit structure, and a build-up circuit structure is provided. The first circuit structure and the second circuit structure are respectively disposed on two opposite surfaces of the core layer. The build-up circuit structure includes a first dielectric layer disposed on the first circuit structure, first conductive blind holes, a second dielectric layer disposed on the first dielectric layer, second conductive blind holes, and a patterned circuit layer disposed on the second dielectric layer. The first conductive blind holes penetrate through the first dielectric layer and electrically contact the first circuit structure. The second conductive blind holes penetrate through the second dielectric layer and electrically contact the first conductive blind holes respectively. The patterned circuit layer electrically contacts the second conductive blind holes. A manufacturing method of the multi-layer circuit structure is also provided.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an ideal conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate. An embedded flexible circuit board made by the method is also provided.

A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.