An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A flexible and/or stretchable structural system for transmitting electrical signal between first and second rigid portions comprises a body structure and said first and second portions arranged to said body structure. The modulus of elasticity of said first portion is lower than the corresponding modulus of elasticity of said second portion. In addition the modulus of elasticity of said body structure is lower than the corresponding modulus of elasticity of said second portion. The system comprises also an interface portion, such as e.g. an electrically conducting fabric, textile or knit, which is arranged to said body structure and between said first and second portions. The interface portion electrically connects said first and second portions. The modulus of elasticity of said interface portion is lower than the corresponding modulus of elasticity of said second portion.

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.

A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.

A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.

The invention relates to an operator control unit for a measuring instrument for process or automation engineering, the operator control unit consisting of at least two adjacently arranged control panels (10a), the control panels (10a) being operated by pressing on a respective shape-variable or elastic housing region (2a) having a respective capacitive sensor element (11) disposed thereunder. The sensor elements (11) each have a first electrode (11a) as a lower plate capacitor and a counter-electrode (11b) arranged in parallel thereabove as an upper plate capacitor, and pressing on one of the housing regions (2a) causes the respective upper plate capacitor (11b) to approach the respective lower plate capacitor (11a), thus changing the capacitance. The first electrode (11a) is attached to a first carrier material (12) and the counter-electrode (11b) is attached to a second carrier material (13). According to the invention, the housing regions (2a) are arranged adjacently to one another in an uninterrupted manner, and the sensor elements (11) are parts of a multi-layered composite printed circuit board (100), which bears against the inner sides of the housing regions (2a), wherein the composite printed circuit board (100) comprises at least the first carrier material (12), which consists of a plurality of segments of rigid circuit boards each with flexible intermediate pieces arranged therebetween, and the second carrier material (13) in the form of a conductive layer, which two carrier materials are spaced apart from one another via an interposed plastic layer (15), forming a measuring chamber (17), and wherein the plastic layer (15) has a plurality of interruptions for forming the sensor elements (11) and a decoupling region (16) between the control panels (10a).

An electronic assembly and a manufacturing method thereof are provided. The electronic assembly includes a carrier substrate including a flexible structure and a circuit structure, and an electronic device disposed on the circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern overlying thereon. The circuit structure includes a second dielectric layer overlying the first dielectric layer and the conductive pattern, and a circuit layer disposed on and passing through the second dielectric layer to be in contact with the conductive pattern, the first flexible structure includes a first portion embedded in the circuit structure and a second portion connected to the first portion and extending out from an edge of the circuit structure. The electronic device includes chip packages electrically coupled to the flexible structure through the circuit structure, and is sized to substantially match a size of the first portion of the circuit structure.

A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.