A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.

A circuit substrate of one aspect of the present invention includes a first substrate body made of a flexible wiring substrate and having a first edge and a second edge opposite to the first edge, the first substrate body having a bottomed or bottomless recess adjacent to the first edge; a plate-shaped or frame-shaped reinforcement member disposed in the recess of the first substrate body adjacent to the first edge; a pair of resin layers sandwiching the reinforcement member in the recess and a portion of the first substrate body adjacent to the reinforcement member including the first edge, each of the resin layers having a circuit portion formed thereon electrically connected to the flexible wiring substrate.

The present disclosure relates to a printed circuit board including a first insulating layer; and a plurality of connection pads disposed on one surface of the first insulating layer, wherein the first insulating layer has a groove portion penetrating a portion of the first insulating layer in respective regions between the plurality of connection pads, and a display module including the same.

A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area.

A rigid flex circuit board is provided, including a flexible circuit board, which includes a core layer, first and second cover layers, first and second bonding layers, first and second dielectric layers, and first and second superposition layers. The core layer includes first and second core circuit layers. The first and second cover layers cover a portion of the first and second core circuit layers. The first and second bonding layers cover a portion of the first and second cover layers. The first and second dielectric layers cover a portion of the first and second core circuit layers and the first and second cover layers. The first superposition layer is disposed on the first bonding layer and the first dielectric layer, and the second superposition layer is disposed on the second bonding layer and the second dielectric layer.

A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.

A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.

Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.

The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.

An extensible flexible printed circuit board sets one or a plurality of flexible printed circuit boards each including a plurality of conductive layers and an insulting layer as a base circuit board, and includes: component mounting partners which are provided at least at parts of the base circuit board, and capable of mounting electronic components an extensible conductive part which is provided at least at a part of the base circuit board includes a plurality of joint parts each intersecting a center line in an extension/contraction direction and a plurality of curved parts each continuing from an end part of each joint part and curve, and exhibits extensibility by the curved parts curving to open or close; and a covering member whose material is a flexibly deformable elastomer, and which covers the component mounting parts and the extensible conductive part.