Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.

Provided is an electronic control device capable of suppressing outflow of a sealing material to the outside and reducing defective attachment of a bracket.

The electronic control device 1 to be attached to a bracket 2 includes a cover 4 (first housing) and a case 3 (second housing) fitted to the cover 4. The cover 4 (first housing) includes a first flange 4F and a first groove portion 31 filled with a sealing material 5. The case 3 (second housing) includes a second flange 3F overlapping the first flange 4F, and a case protrusion 33 (protrusion) fitted to the first groove portion 31 and embedded in the sealing material 5. The first flange 4F of the cover 4 (first housing) has a second groove portion 41 present at a position that is closer to the outside than the first groove portion 31 is.

A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

An electronic device with storage functionality is provided. The electronic device includes a first housing member, a first circuit board, a second housing member and a second circuit board. The first circuit board is connected to the first housing member. The second circuit board is coupled to the first circuit board and is parallel to the first circuit board. The first housing member includes two hooks, and the hooks are wedged against the first edge of the second circuit board.

A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.

An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole. The sealing material 28 has penetrated into the exposed portion 25a of the base material.

A housing assembly for a component includes a base portion having a holding element, a cover portion having an actuation element, and a carrier element carrying the component. The holding element holds the carrier element by engaging with the actuation element. The actuation element applies a contact force on the holding element and is adjustable with respect to the holding element in at least one direction when the holding element is engaged with the actuation element.

One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.

A sensor unit includes a physical quantity sensor, a connecter to be coupled to the outside, a board on which the physical quantity sensor and the connecter are installed, and a container accommodating the board. The board is provided with a first region in which the connecter is installed, a second region in which the physical quantity sensor is installed, and a coupling region disposed between the first and second regions and having a sectional area S3 that is smaller than a sectional area S1 of the first region and a sectional area S2 of the second region in a sectional view as seen in a direction orthogonal to a direction in which the first region and the second region are arranged, and a region in the second region of the board on the coupling region side is attached to the container via a fixation member.