Provided is an ultraviolet (UV) light source. The UV light source includes: a substrate coupled to an upper housing; a light-emitting diode (LED) package on the substrate; and a waterproof coating layer on at least a portion of the substrate, wherein the LED package includes: an LED chip configured to generate UV light; and a transparent layer including a lower surface facing the LED chip, an upper surface opposite to the lower surface, and a lateral surface connecting the upper surface to the lower surface, wherein at least a portion of the upper surface of the transparent layer is exposed from the waterproof coating layer, and the transparent layer is configured to directly contact a sterilization-target fluid.

A capacitor module has a module case including a lower case and an upper case. A housing case is fixed to an inner face of the upper case, and a capacitor is housed in the housing case. A circuit board is fixed to an upper face of the lower case. The circuit board has wiring that is electrically connectable to the capacitor, and electronic components and constituting a circuit that controls electric current to the capacitor are mounted on the circuit board.

An electronic control device (10) includes a housing having a plurality of housing members (1) joined together, a housing vent hole (2) formed through the housing member (1) so as to extend in a thickness direction of the housing member, a protection wall (3) covering an outer opening (2b) of the housing vent hole (2), with a gap (3b) left between the protection wall (3) and the outer opening (2b), a protection-wall vent hole (3a) formed in the protection wall (3) at a position apart from the housing vent hole (2) so as to extend from the gap (3b) in a radial direction of the housing vent hole (2), and an air-permeable waterproof membrane (5) fixed to an inner opening (2a) of the housing vent hole (2). A vent passage (6) with a bent part (6a) is formed between the air-permeable waterproof membrane (5) and the protection-wall vent hole (3a).

An enclosure assembly for enclosing an electronic controller. The enclosure assembly comprises a housing having a plurality of cavities formed therein for receiving electrical components of the electrical controller. The enclosure assembly further includes an over-molded part formed from an elastic material that lines at least a portion of each cavity. The over-molded part reduces the effect of deceleration forces on the electrical component that is received in the cavity thereby protecting it from damage. The over-molded part includes a retention feature that locates the over-molded part within the cavity and secures it to the enclosure assembly. An interference fit is provided between the over-molded part and the electrical component received in the cavity.

There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a. The circuit board 1 penetrates the case member 13 such that the terminal forming region 3 is exposed to a housing space 22 side of the male connector housing 13a.

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

A circuit board is sealed and housed in a casing including a base and a cover, a connector housing including a partition wall is mounted on the circuit board, and an electrical connection between the interior and the exterior of the casing is established. A water-repellent filter is fixed to an inner surface of the partition wall, an outer surface portion of the water-repellent filter is opened to atmosphere via the breath ventilation hole, and an atmospheric opening surface thereof is formed such that the atmospheric opening surface being wetted directly with water is avoided by a poured water blocking wall and water barrier walls. A position where the poured water blocking wall is provided is changed by an insert mold in response to the direction of the mounting surface of the base.

Embodiments include a protective cover for a control module mounted to a vehicle surface using attachment mechanisms that extend perpendicularly from the vehicle surface. The protective cover comprises a rigid top portion having a top surface and four sidewalls configured to cover the control module and engage the vehicle surface. The protective cover also comprises a plurality of insets molded into at least two of the sidewalls, each inset configured to receive a respective attachment mechanism. Embodiments also include an apparatus for protecting a control module mounted to a vehicular surface using a plurality of attachment mechanisms. The apparatus comprises a rigid top structure configured to completely cover the control module and a flexible gasket coupled to a bottom edge of the top structure and configured to removably engage the vehicular surface surrounding the control module in a fluid-tight seal.

A case configured with a base and a cover watertightly contains a circuit board, and a connector housing having a diaphragm is mounted in the circuit board so that the inside and the outside of the case are electrically connected with each other; an outer ring-shaped circumferential wall is provided on the outer surface of the diaphragm, and a protrusion portion having first and second ventilation holes is provided at the side surface of the outer ring-shaped circumferential wall; one end of each of the first and second ventilation holes communicates with the outer surface portion of a water-repellent filter provided on the inner wall surface of the diaphragm, and the other end thereof communicates with the inside of a recess portion that is situated at a side of the mating connector and fits with the protrusion portion.

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.