H05K5/0211

DEVICE TEMPERATURE ADJUSTMENT
20250098126 · 2025-03-20 ·

Systems associated with device temperature adjustment are described. A device temperature adjustment system can include an electronic device having a temperature sensor integrated therein to detect a temperature of the electronic device and a temperature adjust module coupled to the electronic device to adjust a temperature of the electronic device based on the detected temperature.

Wi-Fi hotspot translation mobile phone
12401738 · 2025-08-26 · ·

The invention relates to a Wi-Fi hotspot translation mobile phone, having a Wi-Fi hotspot and translation device, using the oscillating heat dissipation module to improve the heat dissipation performance, and then using the phase change temperature regulating micro airbag to achieve the effect of intelligent temperature adjustment, integrating the traditional Wi-Fi hotspot machine and translation machine, and becoming a compound machine of Wi-Fi hotspot and translation device, it is combined with the smart phone, using the artificial intelligence chip, parallel computing and processing, so that the working efficiency of the Wi-Fi hotspot and translation device is greatly improved, and then has the function of integrating the functions of Wi-Fi hotspot machine, translator machine and smart phone into a Wi-Fi hotspot translation mobile phone that is easy to carry abroad.

Heat insulation pad and electronic device with heat insulation pad

A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.