A storage module installed with multiple M.2 SSDs includes a frame, at least one circuit assembly, and plural M.2 SSDs. The circuit assembly is fixed to the frame along a direction. The circuit assembly includes plural circuit modules and a power connector. The circuit modules are electrically connected to each other in series. Each of the circuit modules includes a circuit board, a M.2 slot, and a signal connector. The circuit board is fixed to the frame. The M.2 slot is fixed to the circuit board. The signal connector is electrically connected to the circuit board and located outside the frame. The power connector is electrically connected to the circuit board of a corresponding one of the circuit modules. The M.2 SSDs plug into the M.2 slots of the circuit modules respectively.

A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.

A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

A memory card includes a card substrate on which a controller and a memory device are mounted, and a card enclosure that accommodates the card substrate and exposes terminals for electrical connection to an external device. The controller is operable in a universal flash storage (UFS) mode and in a first sub-mode other than the UFS mode. The terminals that are exposed include a UFS terminal group according to a UFS standard, and a first sub-mode terminal group. The UFS terminal group includes first row terminals arranged adjacent to an insertion side edge of the memory card and second row terminals arranged apart from the insertion side edge such that the first row terminals are provided between the second row terminals and the insertion side edge. The first sub-mode terminal group is adjacent to the first row terminals.

A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.

A memory card is provided with various pad layouts to prevent a data signal pad from contacting a power contact in a host during insertion and removal of the memory card. The memory card can have a form factor and features that accommodate a relatively-large memory with relatively-high performance and accompanying thermal conditions. An efficient card lock mechanism is also provided.

A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connected to the first case edge, a third case edge connected to the second case edge, a fourth case edge connected to the third case edge and the first case edge, and a first recessed groove formed in the second case edge, the first recessed groove being spaced apart from the first case edge and inwardly recessed. The integrated circuit package is disposed in an upper portion of the case between the first case edge and a first horizontal line that extends in a direction from a top end of the first recessed groove in the second case edge to the fourth case edge.