A modular printed circuit board assembly is provided. The modular printed circuit board assembly includes a housing unit. The housing unit includes a plurality of connectors, a heat transfer unit, and an identification unit. The plurality of connectors connects a host interface board of a plurality of host interface boards with a plurality of module boards and connects a module board of the plurality of module boards with the plurality of host interface boards. The host interface board includes information about an electronic device. The heat transfer unit dissipates the heat to a heat sink. The heat sink is a passive heat exchanger for conducting the heat generated by the electronic device. The identification unit is configured to read the unique identification of the electronic device from the host interface board to determine a structural combination of the electronic device.

This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.

Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

Electronic device structures may include a sleeve member including a cavity extending from a first end of a body toward a second, opposite end, and an opening in communication with the cavity at the first end of the sleeve member. A frame configured to engage an electronic device member, such as a substrate bearing electronic components, may be sized and shaped to be positioned at least partially in the cavity. The frame may include a connector interface at a first end of the frame, the connector interface sized and shaped to at least partially occlude the opening and to accommodate a portion of the substrate extending therethrough and comprising a blade bearing electrical contacts. Support members may extend from proximate the connector interface toward a second end of the body within the cavity when the frame is located at least partially in the cavity.

The present application provides a memory device. The memory device includes a connector plate having a front edge and a rear edge opposite to the front edge, wherein the connector plate comprises an edge connector disposed at the rear edge and configured to connect to a host connector of a host device; a controller plate defining a first connection region, a second connection region and a chip region, wherein the controller plate is attached to the connector plate at the first connection region, and the controller plate comprises a memory control module disposed in the chip region and in electrical communication with the edge connector; and at least one memory module detachably connected to the controller plate at the second connection region of the controller plate, wherein each of the at least one memory module is in electrical communication with the memory control module when the memory module is connected to the controller plate, such that the memory module can be accessible by the host device via the memory control module.

A transfer module adapted to an electronic device is provided. The electronic device includes a circuit board and a plurality of storage units. The transfer module includes a transfer plate and a supporting structure. The transfer plate has a plurality of plug portions, and the transfer plate is adapted to be connected to the circuit board. The supporting structure is connected to the transfer plate. The supporting structure is adapted to support the storage units, such that the storage units are plugged to the plug portions respectively and connected to the circuit board through the transfer plate.

Electronic device structures may include a sleeve member including a cavity extending from a first end of a body toward a second, opposite end, and an opening in communication with the cavity at the first end of the sleeve member. A frame configured to engage an electronic device member, such as a substrate bearing electronic components, may be sized and shaped to be positioned at least partially in the cavity. The frame may include a connector interface at a first end of the frame, the connector interface sized and shaped to at least partially occlude the opening and to accommodate a portion of the substrate extending therethrough and comprising a blade bearing electrical contacts. Support members may extend from proximate the connector interface toward a second end of the body within the cavity when the frame is located at least partially in the cavity.

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, computing devices may use data stored in storage devices. When using the data stored on the storage devices, the storage devices may generate heat. To manage the heat generated by the storage devices, the storage devices may be positioned within housing structures that facilitate dissipation of the heat. Once positioned within the housing structures, the housing structures may be positioned within a module that facilitates operable connection with a storage controller while simultaneously enhancing the dissipation of the heat. The storage controller may manage the data stored on the storage devices to provide the computer implemented services.

A vibration-proof mounting apparatus device is provided for mounting a memory card. The main mounting apparatus comprises a mounting member, a windshield, and an elastic element. The elastic element connects the mounting member and the windshield. The windshield drives the mounting member to move. The windshield presses down against the mounting member and securely holds the memory card for correct connectivity at all times.

Described are systems, methods and computer-program product for replacing a prior input/output (I/O) module and terminal board with a universal I/O device by providing software based instructions and configuration settings for the installer. The method includes provisions for new wiring changes or harnesses as well as preset adapters, converting prior device configuration settings from an I/O module, pack, and/or terminal board to new configuration settings for a programmable I/O device, generating a wiring chart for any wiring changes based on the settings, and displaying the information for the installer and/or programmer's use. This allows a universal I/O device capable of each channel having different operating modes to replace one or more of a mixture of several types of dedicated I/O modules. The installation documentation and configurations are automatically generated, reducing the chance of errors due to misinterpretation of multiple product documents while allowing the automatic transfer of product settings.