The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

An IC socket (11) comprises contact pins (14) disposed in the socket body (13) to be disjunctive to terminals of the IC package (12), an opening and closing body (19A,19B) rotatably provided in the socket body (13), the opening and closing body (19A,19B) having a pressing member (23a,23b) for pressing a top surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13); and an operating member (20) for opening and closing the opening and closing body (19A,19B) disposed up and down movably with respect to the socket body (13). A first opening and closing body (19A) having a heat sink (23a) for pressing an entire of the top surface of the IC package (12) and a second opening and closing body (19B) having a block (23b) for pressing the heat sink (23a) are disposed at different positions mutually.

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

An electrical connector assembly includes an electrical connector and a CPU. The electrical connector includes an insulative housing defining a receiving cavity, and a plurality of contacts retained to the housing with corresponding contacting sections exposed in the receiving cavity. A first securing piece is attached upon the CPU, and a second securing piece is attached upon the housing. When the CPU is received within the receiving cavity, the first securing piece is locked with the second securing piece so as to have the CPU retained to the connector in position wherein the corresponding contacts of the electrical connector are mechanically and electrically connected to the corresponding contacting pads of the CPU in a compression manner reliably.

To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.

A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

An opening/closing mechanism of a cover member that can easily push down the cover member by the lever member even if the force from the base member side to the cover member is increased, improving the operability of the lever member. A solution is that the lever member 17 is rotatably supported to the base member 23 by the first shaft 31, the link plate 29 is mounted to the lever member 17 by the second shaft 32, the cover member 15 is mounted to the link plate 29 by the third shaft 33, and the link plate 29 is rotated around the axis of the first shaft 31 in the direction in which the lever member 17 closes, so that the link plate 29 moves through the second shaft 32, and the link plate 29 moves, so that the cover member 15 is depressed through the third shaft 33.

To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.

An electrical connector includes an insulative housing and a plurality of contacts retained in the housing, a carrier associated with an electronic package therein to be loaded into the housing, a load plate pivotally mounted by one end of the housing for downwardly abutting against the electronic package for assuring mechanical and electrical connection between the electronic package and the contacts, and a dust cover detachably attached to the carrier during shipping while being removed from the carrier when the electronic package is loaded unto the housing and downwardly pressed by the load plate in a later time.

An electrical connector includes a stiffener, a rail frame pivotally mounted to one end of the stiffener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the stiffener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels and above the sliding channels in the vertical direction.