An electrical connector includes a fastener, a rail frame pivotally mounted to one end of the fastener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the fastener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels. A pair of protection blocks are located in front of the pair of sliding channels for protecting the latches of the carrier frame or the CPU.

A connector includes an insulative housing, a plurality of contacts retained in the housing, and a metallic stiffener surrounding the housing. A first pivot section and a second pivot section respectively located at opposite rear and front ends of the stiffener. A first lever is pivotally mounted upon the first pivot section and a second lever is pivotally mounted upon the second pivot section. The first lever includes a first pivot mounted upon the first pivot section, and a first handle moveable between a closed position and an open position. The first pivot includes an offset section on which a load plate is pivotally mounted. The first pivot section includes a stopper limiting outward rotation of both the first lever and the load plate at more than ninety degrees so as not to hinder loading/unloading the CPU with regard to the housing in the vertical direction.

A power conversion device includes a casing, a first printed board, a second printed board, and a control circuit board. The casing has at least two inner surfaces. The first printed board is fixed to the inner surface of the casing. The second printed board is fixed to the inner surface of the casing, and disposed so as to intersect with the first printed board. The control circuit board is disposed along the second printed board. The control circuit board includes a circuit wiring and a shield pattern opposite to the circuit wiring in a layer different from the circuit wiring. When viewed from an opposite direction in which the shield pattern is opposite to the circuit wiring, the shield pattern at least partially overlaps the circuit wiring.

To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

An electronic component includes a first module, a second module and a third module between the first module and the second module. Each of the first module and the second module includes a plurality of conductive pads thereon. A connecting part includes a plate body and a plurality of first tails and a plurality of second tails respectively extending on two opposite sides of the plate body wherein the first tails are soldered upon the first conductive pads and the second tails are soldered upon the second conductive pads, respectively. Each of the first tails and the second tails includes a mounting pad with a through hole therein, and a folded section on the end edge with a solder unit received with a space formed in the folded section and communicatively above the corresponding through hole.

Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

An electrical connector includes an insulative housing and a plurality of contacts retained in the housing, a carrier associated with an electronic package therein to be loaded into the housing, a load plate pivotally mounted by one end of the housing for downwardly abutting against the electronic package for assuring mechanical and electrical connection between the electronic package and the contacts, and a dust cover detachably attached to the carrier during shipping while being removed from the carrier when the electronic package is loaded unto the housing and downwardly pressed by the load plate in a later time.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

A reusable member configured to retain and release an add-in card to and from a motherboard without additional tools and/or processes. The add-in card has an end inserted into a connector mounted on the motherboard and another end distal from the connector. The member has a retaining portion configured to extend through the distal end of the first circuit board, and a mounting portion configured to extend through an opening of the second circuit board. The retaining portion has a sub-portion configured to move between a first position for retaining the add-in card and a second position for releasing the first circuit board. The mounting portion has a sub-portion disposed and secured in the opening of the motherboard when the member is inserted. Such a configuration enables reusing the member with circuit boards of various dimensions, without additional tools and/or processes.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.