An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

A power conversion device includes a casing, a first printed board, a second printed board, and a control circuit board. The casing has at least two inner surfaces. The first printed board is fixed to the inner surface of the casing. The second printed board is fixed to the inner surface of the casing, and disposed so as to intersect with the first printed board. The control circuit board is disposed along the second printed board. The control circuit board includes a circuit wiring and a shield pattern opposite to the circuit wiring in a layer different from the circuit wiring. When viewed from an opposite direction in which the shield pattern is opposite to the circuit wiring, the shield pattern at least partially overlaps the circuit wiring.