A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.

An electrical connector assembly includes an insulative housing, a plurality of contacts retained to the housing, a metallic frame/fastener surrounding the housing, a retainer/clip positioned upon the housing and retaining a CPU thereon. The metallic frame includes four positioning posts at four corners, and the retainer includes a frame part to form a receiving space for receiving the CPU therein, and further includes four metallic retaining supports embedded within four corners of the retainer corresponding to the four positioning posts so as to allow the four positioning posts to extending therethrough in the vertical direction.

Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

An electrical connector includes an insulative base, an insulative cover attached upon the base and moveable along a front-to-back direction, and an operation lever sandwiched between the base and the cover for moving the cover relative to the base in the front-to-back direction. The lever includes an actuating bar sandwiched between the upper head and the lower head, and an operation bar exposed outside of the base and the cover. The operation bar is rotatable between a horizontal position and a vertical position. The lower head includes a stopper around a front end of the operation bar with a locking section engaged with the operation bar wherein said locking section extends toward the operation bar either inwardly along the transverse direction or in the front-to-back direction.

The electrical connector includes an insulative housing for receiving the CPU therein with a plurality of contacts retained thereto, a fastener located beside the housing, and a load plate pivotally mounted upon the fastener and covering the housing for holding the CPU in position. The load plate includes opposite first and second sides and opposite first and fourth sides to commonly form a center opening. The first and second sides form first protrusions with corresponding first pressing sections, and the third and fourth sides forms second protrusions with corresponding second pressing sections. During operation, both the first pressing sections and the second pressing sections act upon the CPU.

A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.