An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination.

A clip is used for carrying a chip module to assemble to an electrical connector along a vertical direction. The clip includes a retaining mechanism retaining the chip module and a central opening provided for a part portion of the chip module going through. The clip has an anti-mismating member. When the clip is assembled to the electrical connector by itself disposed in a right-to-left direction perpendicular to the vertical direction or reversely relative to a front-to-back direction perpendicular to the vertical direction, the anti-mismating member stops the clip to be assembled to the electrical connector.

An electrical connector includes a contact array of signal pins and an integrated ground plane. In one embodiment, the electrical connector includes an array of contact elements and the integrated ground plane includes openings for contact elements forming signal pins and includes closed portions positioned over contact elements to be connected to the ground potential. The array of contact elements is formed with a subset of the contact elements being trapped or compressed under the integrated ground plane. The trapped contact elements are electrically connected to the ground potential without each being connected to a ground connection external to the connector. The integrated ground plane can be provided integrally within the electrical connector or as a separate element attached to the connector. In another embodiment, an electrical connector includes an array of contact elements formed in a contact element layer incorporating an integrated ground plane.

Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.

A chip connector adapted for electrically connecting a chip module to a circuit board includes: an insulative housing loaded with plural terminals and mounted on the circuit board; a frame surrounding the insulative housing and mounted on the circuit board; and a rotating plate defining a first end and a second end opposite to the first end, the first end of the rotating plate being pivotally installed on a first end of the frame; wherein the second end of the rotating plate defines a first locking portion, the frame defines a second locking portion at a second end opposite to the first end thereof, and the first locking portion is releasably locked with the second locking portion by pushing the rotating plate toward the frame.