An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.

A fixing apparatus for holding a circuit board in place includes a cover plate, a base for supporting the circuit board thereon, a connecting assembly for hinge-coupling a first end of the cover plate to the base, and a latching assembly for latching a second end of the cover plate to the base. The circuit board is held in place between the base and the cover plate.

Aspects of the disclosure provide a pallet and a method for supporting a printed circuit board (PCB) during a circuit board assembly process. The pallet includes a panel having a frame area surrounding a depression area for receiving a PCB. The pallet includes at least one fixed tooling pin attached to the panel at a first location in the depression area. The pallet further includes at least one movable tooling pin positioned at a second location in the depression area, and the movable tooling pin is movable between a release position for installing the PCB in the depression area and a secure position for securing the PCB in the depression area.

Aspects of the disclosure provide a pallet and a method for supporting a printed circuit board (PCB) during a circuit board assembly process. The pallet includes a panel having a frame area surrounding a depression area for receiving a PCB. The pallet includes at least one fixed tooling pin attached to the panel at a first location in the depression area. The pallet further includes at least one movable tooling pin positioned at a second location in the depression area, and the movable tooling pin is movable between a release position for installing the PCB in the depression area and a secure position for securing the PCB in the depression area.

This disclosure relates to a structure that conveniently and easily releases computer components from a supporting structure. A typical computer component would be a PCIe card within a GPU tray. The disclosed structure does not require the use of tools to release computer components, and can be used where computer components ordinarily cannot be released due to limitations of space. The structure lifts the computer component to a height where the computer component can be easily grasped by human fingers for removal of the component.

An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

A circuit board module includes a bracket, a first circuit board, a first resilient member and a second resilient member. The bracket has at least one protruding pillar. The first circuit board is disposed on the bracket. The first circuit board has at least one through hole and at least one first connector. The at least one protruding pillar passes through the at least one through hole. The at least one first connector defines an assembling direction. The first resilient member is disposed at a first side of the first circuit board. The first circuit board is configured to move in a first direction and compressing the first resilient member. The second resilient member is disposed at a second side of the first circuit board. The first circuit board is configured to move in a second direction and compressing the second resilient member.

An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.