A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

A latching mechanism includes a body having a trip-latch with a protruding portion that protrudes from the body, a release button coupled to a release shaft disposed inside the body, and a holding edge disposed on the release shaft. The holding edge engages the trip-latch to maintain the release button in a depressed position. The holding edge disengages the trip-latch to place the release button in a non-depressed position in response to urging the protruding portion of the trip latch toward the rotatable body. The latching mechanism may also include a spring coupled to the release shaft that urges the release button to a non-depressed position. The latching mechanism may also include a spring coupled to the protruding portion of the trip-latch that urges the trip-latch to protrude from the body. A non-protruding portion of the trip-latch may engage the holding edge.

An instrumentation system that can include a chassis configured to receive a PCB assembly, where the PCB assembly can include a front edge forming a front plane, a first rear edge forming a first rear plane, and a second rear edge forming a second rear plane, with the first rear plane being spaced a greater distance away from the front plane than the second rear plane, and where the chassis can include a plurality of card slots configured to receive the PCB assembly, a 3U backplane configured to couple with the second rear edge of the card when the PCB assembly is installed in one of the plurality of card slots in the chassis.

A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.

A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

The present disclosure discloses a node safe locking device and a server. An outer rail is disposed between two adjacent node modules. A middle rail is slidably assembled at the outer rail. Each middle rail is driven by one node module to translate in a same direction. When the middle rail moves, the linking and interlocking rod may be driven to reach different positions. When the middle rail moves outwards from the initial position together with one of the node modules, the locking guiding lean edge drives the linking and interlocking rod to move to the locking position. At this time, the blocking locking edge of the middle rail corresponding to the other node module is blocked by the linking and interlocking rod located at the locking position, and the node module may not move outwards to realize locking.