A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

A synergistic composition can be used to treat water containing nitrogen compounds and phosphorus compounds. The synergistic composition includes iron filings, clay particles, aluminum particles, and sand particles. The iron filings, clay particles, and aluminum particles act synergistically to remove nitrogen compounds and phosphorus compounds from water. Specifically, the clay particles attract the nitrogen compounds and the phosphorus compounds to be absorbed onto a surface of the iron filings and the clay particles. The aluminum particles react with the nitrogen compounds via an oxidation reaction to form ammonia compounds, and react with the phosphorus compounds to produce aluminum phosphate. As such, the synergistic relationship between the iron filings, clay particles, and aluminum particles remove nitrogen and phosphorus compounds from water and recover the compounds in usable forms, namely, ammonia and aluminum phosphate.

A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.

A housing includes a base and a mark piece. The base includes a bottom wall and at least one side wall. The at least one side wall is vertically connected to the bottom wall. A height of the side wall exists between a top end of the at least one side wall and the bottom wall. The mark piece is disposed on the bottom wall and extends from the bottom wall in a direction away from the bottom wall. The mark piece has a low scale and a high scale. A distance from the low scale to the bottom wall is less than the height of the side wall. A distance from the high scale to the bottom wall is substantially the same as the height of the side wall.

A synergistic composition can be used to treat water containing nitrogen compounds and phosphorus compounds. The synergistic composition includes iron filings, clay particles, aluminum particles, and sand particles. The iron filings, clay particles, and aluminum particles act synergistically to remove nitrogen compounds and phosphorus compounds from water. Specifically, the clay particles attract the nitrogen compounds and the phosphorus compounds to be absorbed onto a surface of the iron filings and the clay particles. The aluminum particles react with the nitrogen compounds via an oxidation reaction to form ammonia compounds, and react with the phosphorus compounds to produce aluminum phosphate. As such, the synergistic relationship between the iron filings, clay particles, and aluminum particles remove nitrogen and phosphorus compounds from water and recover the compounds in usable forms, namely, ammonia and aluminum phosphate.

An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

A circuit board separation mechanism may include a separation block positioned within a separation block cut-out of a heatsink. The heatsink may be positioned between a first circuit board including a first component of at least one connector and a second circuit board including a second component of the at least one connector. The circuit board separation mechanism may include a set screw inserted in the separation block. A portion of the set screw may be configured to engage a surface of the heatsink. The separation block may be configured to lift against a surface of the first circuit board when the set screw is rotated. The first component of the at least one connector and the second component of the at least one connector may be configured to separate when the set screw is rotated and the separation block lifts against the surface of the first circuit board.

Embodiments for electronic device fasteners that enable an electronic device to be reliably and quickly secured on a host board are presented. In one exemplary embodiment, a fastening assembly includes a glider component that supports an electronic device such as an M.2 solid state drive, and slides on tracks installed on a host board to bring a handle bar in a locking position above the electronic device securing the electronic device in place. The glider component and the tracks are designed with sloped surfaces such that as the glider component slides over the tracks, when it reaches an end of the track, a stable engagement secures the electronic device in place without the need for any additional fastening mechanisms.

A pull-out aiding device is configured for mounting on an object, in which a corresponding apparatus is mounted. The pull-out aiding device includes a pulling member and a handle member. The pulling member includes a first pivot section and an abutting section for abutting against the corresponding apparatus to move the latter forward. The handle member includes a second pivot section and an operating section. The second pivot section is pivotally connected to the first pivot section, such that the handle member is turnable about the second pivot section relative to the pulling member and brings the latter to move forward.