Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

Examples may include sleds for a rack in a data center including physical compute resources and memory for the physical compute resources. The memory can be disaggregated, or organized into near and far memory. A first sled can comprise the physical compute resources and a first set of physical memory resources while a second sled can comprise a second set of physical memory resources. The first set of physical memory resources can be coupled to the physical compute resources via a local interface while the second set of physical memory resources can be coupled to the physical compute resources via a fabric.

Technologies for adaptive processing of multiple buffers is disclosed. A compute device may establish a buffer queue to which applications can submit buffers to be processed, such as by hashing the submitted buffers. The compute device monitors the buffer queue and determines an efficient way of processing the buffer queue based on the number of buffers present. The compute device may process the buffers serially with a single processor core of the compute device or may process the buffers in parallel with single-instruction, multiple data (SIMD) instructions. The compute device may determine which method to use based on a comparison of the throughput of serially processing the buffers as compared to parallel processing the buffers, which may depend on the number of buffers in the buffer queue.

Out-of-band management techniques for networking fabrics are described. In an example embodiment, an apparatus may comprise a packet-switched network interface to deconstruct a packet received via an out-of-band management network and control circuitry to execute an out-of-band management agent, and the out-of-band management agent may be operative to identify a configuration command comprised in the received packet and control an optical circuit-switched network interface based on the configuration command. Other embodiments are described and claimed.

The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.

A fixing device for fixing a display card on a circuit board, includes a backplane and a support bracket. The backplane includes a substrate plate, and a first engaging part. The substrate plate is fixed on the display card. The first engaging part is disposed on the substrate plate. The support bracket includes at least one support leg and a second engaging part. The support leg includes a first end and a second end. The first end is connected with the circuit board. The second engaging part is connected with the second end and engaged with the first engaging part.

The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

A computing system including a housing assembly having a front and a rear, a CPU module positioned towards the front of the housing assembly and including a plurality of I/O connectors, and a plurality of I/O modules positioned towards the rear of the housing assembly, where each I/O module includes a second I/O connector. The computing system also includes a plurality of riser cards each having a PCB with opposing side surfaces, a front edge, a rear edge, a top edge, a bottom edge, a third I/O connector coupled to the bottom edge and a fourth I/O connector coupled to the rear edge. The third I/O connector on each riser card is connected to one of the first I/O connectors and the fourth I/O connector on each riser card is connected to one of the second I/O connectors so that the riser cards are oriented in parallel with each other.

According to an example, a holder for a computing device comprises a first bracket, a second bracket, and a biasing element attached to the first bracket and the second bracket. The first bracket may comprise a first clamp to contact a first side of a computing component and a first attachment member to attach to the computing device so as to fix the first bracket within the computing device. The second bracket may comprise a second clamp to contact a second side of the computing component and aligned with the first clamp. The biasing element may bias the second clamp towards the first clamp.