A scalable system for high-power computer, comprising a plurality of motherboard chassis, inserted in a computer rack mounting kit, each motherboard chassis, being configured to receive at least one motherboard module, said plurality of inner chassis forming a stack of inner chassis, the stack being configured to receive an outer floating bracket chassis, said outer chassis being inserted by a second longitudinal end of each inner chassis forming the stack of inner chassis, each said outer floating bracket chassis being configured to accommodate at least one double floating bracket being configured to house a cable box capable of connecting the connectors of a plurality of motherboard modules, arranged in said inner chassis of the stack, to each other, the system being characterized in that the double floating bracket comprises at least several floating attachment means.

A detachably fixing device includes a base, a circuit board carrying plate, and a sliding plate. The circuit board carrying plate is slidably disposed on the base in a first direction and has a carrying plate linkage portion. The sliding plate is slidably disposed on the base in a second direction. The first direction and the second direction are non-parallel. The sliding plate has a sliding plate linkage portion mechanically connected with the carrying plate linkage portion, and an engaging portion. The circuit board carrying plate is operable to move to make the sliding plate slide outward relative to the base to make the engaging portion protrude from the base. An electronic apparatus casing includes a casing frame and the detachably fixing device. The detachably fixing device is detachably disposed on the casing frame. The engaging portion is separably engaged with an engaging structure of the casing frame.

The disclosure relates to a cage and an electrical device having the same, where the cage is configured to accommodate at least one expansion card and includes a cage body, a rail, and at least one holder. The cage body is configured to accommodate the at least one expansion card. The rail is fixed on the cage body. The rail has a groove configured for an insertion of the at least one expansion card. The at least one holder is movably disposed on the cage body. Part of the at least one holder is removably located in the groove. The at least one holder is configured to block the at least one expansion card in the groove.

An electrical element includes a plate member, a first housing part having a plate insertion section adapted to guide an insertion of the plate member along an insertion direction into a mounting position of the plate member at the first housing part, and a second housing part having a locking element forming a locking with a counter locking element of the first housing part. The second housing part has a latching element engaging a counter latching element of the plate member. The latching element and the counter latching element form a latching in an engaged state.

A chassis for a computing device includes a base component and a top cover. The base component includes guide slots therein. The top cover includes stamped protrusions extending from one or more side slider structures. The slider structurers extend downwardly from a top surface of the top cover. The stamped protrusions are unitary one-piece structures with the one or more side slider structures. The stamped protrusions correspond to respective guide slots of the base component such that the stamped protrusions are positioned in corresponding guide slots when the base component and the top cover are in a mating position.

The discussion relates to loading electronic assemblies on multi-shelf chasses. One example can include a vertical positioning mechanism configured to be secured to a multi-shelf chassis and to align a carrier supporting an electronic assembly with an individual shelf of the multi-shelf chassis. The example can also include a horizontal positioning mechanism configured to extend the carrier along the individual shelf and an anti-deflection mechanism configured to reduce downward deflection of the carrier when the carrier is extended into the electronic assembly loader tool along the individual shelf.

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

An electronic apparatus includes a case, an integrated circuit module, a cable and a fastener component. The case includes an opening and an accommodating space for the integrated circuit module and the fastener component installed therein. The cable is passed through the opening to be electrically connected with the integrated circuit module. The fastener component is adjacent to the opening and includes a first fastening portion and a second fastening portion for fastening the conducting cable and the circuit module respectively. Thereby, the cable and the integrated circuit module will be fastened simultaneously through the fastener component, and a one-time ultrasonic welding process is applied for assembly, thus the process will be simplified as to improve the yield rate.

Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.