A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.

An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.

Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.

An unit housing includes a first housing member, a second housing member, a circuit board disposed at least partially between the first housing member and the second housing member, a positioning column disposed at least partially in the circuit board, a first resilient member connected to the positioning column between the circuit board and the first housing member, and a second resilient member connected to the positioning column between the circuit board and the second housing member.

Systems and methods for providing screw bosses on a substrate. The substrate can be dimpled. The dimples can then be threaded to accept screw bosses. The dimples can be threaded using a threading die or can have threads cut by self-tapping screw bosses. An adhesive can be applied to the substrate, the bottom of the screw boss, or both. The screw bosses can include standoffs to determine the distance between the bottom of the screw boss and the substrate. The screw bosses can be threaded onto the dimples and can provide threads for attaching items to the substrate. A filler material can be applied to the reverse side of the substrate to fill-in the dimples and present a smooth surface. A decorative or protective layer can be applied over the filler material.

An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.

An electronic device is provided. The electronic device includes a housing, a fastened object, a fastener, and a base member. The housing includes a housing body and a bracket. The bracket is integrally formed on the housing body. The bracket includes a bracket stage, a bracket hole and a bracket recess. The bracket hole is formed on the bracket stage. The fastened object corresponds to the bracket stage. At least a portion of the base member is moveably inserted into the bracket recess. The base member includes a member fastening hole. The fastener passes through the fastened object and the bracket hole to connect to the member fastening hole of the base member.

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.