A protective device and a protective method for insulating and buffering an electronic product against the vibration, humidity, heat, and chemicals found in outdoor agricultural machines and thus safeguarding and extending the service life of the electronic products includes a protection space in the device, the electronic products being protected by being suspended in the protection space of the protection device.

A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

A housing assembly for a component includes a base portion having a holding element, a cover portion having an actuation element, and a carrier element carrying the component. The holding element holds the carrier element by engaging with the actuation element. The actuation element applies a contact force on the holding element and is adjustable with respect to the holding element in at least one direction when the holding element is engaged with the actuation element.

A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.

Various technologies for integrating a microinverter with a photovoltaic module are disclosed. An alternating current photovoltaic (ACPV) module includes a photovoltaic module having a frame and a junction box including a direct current (DC) output connector, and a microinverter having a housing coupled to the frame and a DC input connector electrically mated with the DC output connector of the photovoltaic module.

Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.

Techniques are disclosed relating to a locking pin used to secure components in an electronics module. For example, in some embodiments an electronics module includes a housing lower part that includes a lower receiving element and a housing upper part that includes an upper receiving element that is aligned with the lower receiving element. In various embodiments, a locking pin may be used to connect a circuit board in the electronics module. For example, in some embodiments the circuit board includes at least one lead-through opening and the circuit board is connected to the housing lower part via the locking pin that is inserted in a positive-locking manner through the lead-through opening into the lower receiving element. Further, in some embodiments, an upper pin section of the locking pin may be inserted into an upper receiving element of the housing upper part in a positive-locking manner.

An electronic device is disclosed. The disclosed electronic device includes a printed circuit board including at least one through-hole, a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board, and a solder layer for bonding one area of the holder to one surface of the printed circuit board.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.