A card support is provided that passively and automatically adapts to variations in the length of an electronic card. When a card is inserted into a slotted bar of the card support, variations in the length of that card are adjusted for by the compression or expansion of a spring disposed between the slot and a supporting face.

A chassis to receive a line replaceable module including a molded body formed from a composite material, a card guide integrally formed in the molded body to receive the line replaceable module, the card guide including a card guide wall integrally formed in the molded body and extending outwardly from the molded body, and a plurality of tolerance features disposed within the card guide to retain the line replaceable module.

Thermal interface system, and method thereof, are configured to constrain or limit an amount of compression applied to a thermal interface during insertion of an electronic device into a cage, rack, chassis, or other mounting assembly. The thermal interface system and method provide a thermal interface that is embedded within a pocket or cavity formed either on a surface of the device, a surface of the mounting assembly, or both. The thermal interface may be made of any suitable thermally conductive interface material that is resilient or has elastic properties. The pocket or cavity provides a seating for the thermal interface and operates to limit the compression or clamping force directed through the thermal interface. Such an arrangement helps prevent the full compression or clamping force used to secure the electronic device from being applied to the thermal interface.

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available for providing the computer implemented services may be modified. The quantity of hardware resources may be modified by adding removable cards to a host system. The host system may, while the added removable cards are cold, selectively warm the removable cards through conduction heating to retain their temperatures within operating temperature ranges.

Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.

A mounting structure for mounting a data storage device includes a cage, a sliding piece, a door, and a lock. The cage has an opening and a cavity. The sliding piece is slidable between a first position and a second position. The sliding piece has a pushing part. The door is rotatably located on the sliding piece and configured for covering or uncovering the opening. The lock is located on the cage and configured for locking the door to cover the opening. When the data storage device is accommodated in the cavity, the door is locked by the lock and the sliding piece is located on the first position, when the lock unlocks the door and the sliding piece slides to the second position, the pushing part pushes the data storage device outwards from the cavity through the opening. A cabinet and a computing device are also disclosed.

A chassis includes a flash module comprising a cover and an integrated connector, a metal stiffener, an electromagnetic interference (EMI) gasket, and a midplane. The flash module is connected to the midplane using the integrated connector, the integrated connector extends past the cover of the flash module, and, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket, in which the metal stiffener is interposed between the EMI gasket and the midplane.

There is described a control peripheral post of railway field devices, comprising: at least one row of control modules operatively connected or connectable by electric cables to field devices; a support frame having a front side and housing said row of control modules; wherein said support frame comprises at least one anti-extraction bar positioned on the front side of the support frame, said bar being adapted to selectively take an extraction configuration, wherein said bar is positioned in such a way as to permit the extraction of the control modules from the front side of the support frame, and a blocking configuration, wherein said bar is positioned in front of said row of control modules so as to prevent the extraction of the control modules (4, 5) of said row from the front side of the support frame.

A chassis includes a flash module comprising a cover and an integrated connector, a metal stiffener, an electromagnetic interference (EMI) gasket, and a midplane. The flash module is connected to the midplane using the integrated connector, the integrated connector extends past the cover of the flash module, and, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket, in which the metal stiffener is interposed between the EMI gasket and the midplane.

A system and corresponding method for housing circuit boards is provided. The circuit boards may differ in two physical dimensions. The circuit boards are placed in circuit board housings within an enclosure. Substantially planar positionable enclosure partitions of various lengths are strategically placed within the enclosure in order to form the circuit board housings. The positionable enclosure partitions provide a means to create circuit board housings that differ from one another in both a first dimension and a second dimension.