According to one embodiment, an electronic device includes: a housing; a first electronic component inside the housing; a second electronic component arranged inside the housing and spaced apart from the first electronic component; a female connector electrically connected to the second electronic component, the female connector comprising multiple conductive pins; a male connector electrically connected to the first electronic component and configured to contact at least some of the multiple conductive pins of the female connector, the male connector comprising a base film, a conductive layer formed on one surface of the base film, and an adhesive layer formed on the back surface of the base film, thereby forming a lamination structure; and multiple reinforcement members provided on at least one of one surface of the base film and the back surface thereof so as to form a peripheral portion of the lamination structure.

An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.

Sensor assemblies are provided for use in modeling water systems. These sensor assemblies can be used as sensor fish. These assemblies can include a circuit board supporting processing circuitry components on either or both opposing component support surfaces of the circuit board and a housing above the circuit board and the components, with the housing being circular about the circuit board in at least one cross section, and wherein the supporting surfaces of the circuit board are substantially parallel with the plane of the housing in the one cross section. Methods for emulating interaction of entities within water systems are provided. The methods can include introducing a sensor assembly into a water system. The sensor assembly can include: a circuit board supporting processing circuitry components on either or both of opposing component support surfaces of the circuit board; a housing about the circuit board and the components, the housing being circular about the circuit board in at least one cross section; and wherein the support surfaces of the circuit board are substantially parallel with the plane of the housing in the one cross section.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.

A buckle base and buckle-fixing pin combination to be used in fixing a printed circuit board to a sheet includes a buckle base and a buckle-fixing pin. The buckle base is in a generally U-shaped form. The buckle base includes a first leg, a second leg, and a bridge therebetween. The first and second legs are connected to the bridge. The buckle-fixing pin forms a longitudinal slot therein.

Support bracket and support bracket assemblies for a peripheral component interconnect (PCI) card are shown and disclosed. In one embodiment, the support bracket includes a first planar member having opposed first and second end portions, and a second planar member attached to, or formed with, the second end portion. The second planar member is perpendicular to the first planar member and is attachable to an I/O PCI bracket. The support bracket additionally includes a ledge attached to, or formed with, the first planar member. The ledge extends between the first and second end portions and is perpendicular to the first and second planar members. The ledge is sized to support an end portion of the PCI card when the PCI card is attached to the I/O PCI bracket and when the second planar member is attached to the I/O PCI bracket.

A ring-shaped earphone may be configured to be worn in an ear. When not worn in the ear, the ring-shaped earphone may be conveniently stored on a finger. In one example, the ring-shaped earphone may include a ring-shaped body defined by an outer cylindrical surface and an inner cylindrical surface. The earphone may include a speaker within the ring-shaped body. The speaker may be configured to project sound through a speaker opening in the outer cylindrical surface. The earphone may include a microphone within the housing. The microphone may be configured to receive sound through a microphone opening in the inner cylindrical surface.

An electric range is provided that may include a single base bracket configured to support and protect a control circuit board, thereby remarkably reducing a number of components in comparison to a conventional electric range.

Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.

Scalable-bandwidth aggregation boxes are disclosed that allow scalable electrical connection bandwidth of multiple servers in a rack to aggregation modules and compact bifurcatable optical cables to connect the aggregation modules to switches, while minimizing switch faceplate connector area requirements by using optical connectors. Users of a system including scalable-bandwidth aggregation boxes can choose a desired bandwidth cable to connect a server to a switch via an aggregation box. An aggregation box may include a scalable-bandwidth electrical connector on a faceplate, signal lines coupled between the scalable-bandwidth electrical connector and a board connector in the housing, and a serviceable bandwidth-aggregation module removably disposed in the housing.