A process for producing a backplane circuit board (20) having an internal face (142) adapted to be connected to connectors (13) of circuit boards (12) and an external face (143) adapted to be connected to an external connector (15), blind holes (146, 148) opening on the internal face (142) and external face (143) of the backplane circuit board (20), wherein bonding layers (31, 32) having zones (41, 42) cleared of material facing the blind holes are used between the printed circuits (21, 22, 23).

A substrate unit includes a first connector including a first terminal and a first housing accommodating the first terminal, and to be connected to an external connector, a first substrate on which the first connector is mounted, a second connector including a second terminal and a second housing accommodating the second terminal, and to be connected to the external connector, a second substrate on which the second connector is mounted and a case accommodating the first substrate and the second substrate. The first housing is provided with a first locking portion. The second housing is provided with a second locking portion. The first locking portion and the second locking portion are locked to each other. The first terminal and the second terminal are disposed to face an opening provided in the case through which the external connector is to be connected to the first connector and the second connector.

Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.

Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.

A rack adapted for receiving one or more components is disclosed. The rack includes a backplane, a pair of side panels extending from the backplane and internal support members on each side to receive and mechanically guide an initial alignment of components upon their initial insertion in the rack. A pair of male connectors mounted to the backplane is configured to mate with a corresponding pair of female connectors of each component to mechanically guide a final alignment of each component when the component is further inserted in the rack. Mechanical guidance may also be provided by, or supplemented with, a connection capable of providing liquid cooling to the rack. A system including the rack and the component inserted in the rack is also disclosed.

A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.

A circuit board assembly, a backplane interconnection system, and an electronic device are disclosed. The circuit board assembly includes a bracket and a circuit board, the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to a front sub-circuit board, a first connector plug-connected to a first plug-connection end on the front sub-circuit board is disposed on the free part, and the amplitude of swing is capable of enabling the first connector to plug-connect to the first plug-connection end.

A process for producing a backplane circuit board (20) having an internal face (142) adapted to be connected to connectors (13) of circuit boards (12) and an external face (143) adapted to be connected to an external connector (15), blind holes (146, 148) opening on the internal face (142) and external face (143) of the backplane circuit board (20), wherein bonding layers (31, 32) having zones (41, 42) cleared of material facing the blind holes are used between the printed circuits (21, 22, 23).

A handheld communication device includes first and second screens, a hinge to rotate the first and second screens between open and closed positions, and a position sensor to determine the relative position of the first and second screens. The position sensor can be a Hall-Effect sensor.