An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A modular power distribution system comprises a chassis; and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) an OR-ing diode; (ii) a circuit protection device; (iii) a microprocessor controlling the circuit protection device; and (iv) a power output connection location. A circuit option switch is located on each module for setting the current limits for each module. A control module is provided connected to the backplane.

An electronic unit comprising a box defining a reception compartment for receiving an electronic module along two mutually opposite directions of an insertion axis, the compartment including electrical power supply means for powering the electronic module and connection means for connecting the electronic unit to the electronic module, these means extending onto a connection face forming part of the reception compartment and extending parallel to the insertion axis. An electronic module for mounting in a compartment of an electronic unit of the invention.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.

An electronics installation system, especially for an aircraft or spacecraft, includes at least one mechanical installation structure having a plurality of installation slots each configured to receive an electronic module and at least one wiring configuration slot configured to receive a wiring configuration module, and a connection matrix comprising a plurality of data connections, wherein at least one data connection is provided between each one of the installation slots and at least one wiring configuration slot.

The present invention concerns a backplane electronic board (20) having on inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterized in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.

The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board.

An apparatus and a method of use are disclosed herein. The apparatus comprises a disaggregated fault tolerant backplane having a front side and a back side with at least two daughter card slots configured on the front side and configured to receive slot fanout signals over the backplane. The apparatus further comprises at least two switch boards (SBs) configured to provide electrical power to the at least two daughter card slots and at least one main fanout board (MFB) configured to send and receive SB control signals to and from the at least two SBs. The at least one MFB connects to the backplane through at least one MFB connector configured on the back side of the backplane. In one embodiment, the MFB receives control signals from the daughter card slots and sends slot fanout signals to the daughter card slots.