A computing unit configured to be mounted in a HPC cabinet, the computing unit comprising an external body, and an internal body comprising secondary electronic components. The internal body is releasably coupled with the external body in order to allow extraction of the internal body when the external body is secured fixedly to the HPC cabinet. The internal body includes a bottom tray, comprising bottom secondary electronic components, a top tray comprising at least one duct for conducting an air flow from the front to the rear, and a plurality of manual coupling members, accessible from the top of the top tray, releasably coupling the top tray with the bottom tray.

A computing unit configured to be mounted in a HPC cabinet comprising an external body and an internal body. The internal body includes a bottom tray, bottom secondary electronic components, at least a bottom connector connected to the bottom secondary electronic components and a top tray being releasably coupled with the bottom tray. The top tray includes top secondary electronic components and at least a top connector connected to the top secondary electronic components, wherein the top connector is configured to cooperate with the bottom connector when the top tray is coupled with the bottom tray.

A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.

A lock mechanism for securing an expansion card in a computer chassis includes an elongated structural support, a wedge, and a channel structure. The elongate structural support comprising a first and second arm extending obliquely away from each other from a central pivot point positioned between a first and second end of the elongate structural support. The wedge protrudes upwardly from the first arm at the first end of the elongated structural support. The wedge is configured to engage with a riser card component of a riser module including the expansion card and cause a rotation of the elongated structural support about the central pivot point from an unlocked to a locked position. The channel structure extends from the second arm at the second end of the elongated structural support. The channel structure is configured to secure the expansion card with the elongated structural support positioned in the locked position.

A server casing includes a case body, a HDD cage and a backplane assembly. The case body has an opening and an accommodation space connected to the opening. The HDD cage can be inserted into and removed from the accommodation space through the opening. The HDD cage has installation spaces for accommodating the hard disk drives. The backplane assembly includes a connector and a HDD backplane fastened to the HDD cage and configured to be electrically connected to the hard disk drives. The HDD cage further has a front surface and a rear surface. The front surface is closer to the opening than the rear surface. The installation spaces are between the front surface and the rear surface. The HDD backplane extends beyond the rear surface in a direction away from the opening. The connector is located at one end of the HDD backplane extending beyond the rear surface.

A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.

A quick release mechanism includes a fixed component, a first assembly, and a second assembly. The fixed component has a guiding portion and a first positioner. The first assembly includes an engagement component and a return component. The engagement component is pivotably disposed on the fixed component and includes a first protrusion part, a first press part, and a second positioner. The return component keeps the engagement component in an engaged position. The second assembly is removably inserted into the guiding portion. The second assembly includes a second protrusion part and a contact part. The engagement component is movable away from the engaged position by abutting of the second protrusion part on the first protrusion part or by abutting of the contact part on the first press part during insertion of the second assembly into the guiding portion.

An electronic device includes a casing and an expansion card. The casing includes a chassis and an installation frame. The installation frame is pivotably disposed on the chassis. The expansion card is fixed to the installation frame. The expansion card is movable along with the installation frame so as to be located in the chassis or at least partially located outside the chassis.

A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.