An electronic equipment enclosure includes a frame structure and a customizable side air dam kit. The frame structure includes a front frame, a rear frame, front-to-back frame members connecting corners of the front and rear frames together, reinforced bracket structures located near ends of the cross members, and extruded horizontal mounting rails parallel to, but inward from, the front-to-back frame members. The ends of the horizontal mounting rails are connected to the reinforced bracket structures. Panels are installed in longitudinal slots in the front-to-back frame members and horizontal mounting rails, each of which is extruded. The customizable side air dam kit includes a framework of horizontal and vertical frame pieces, adapted to connect to the frame structure, and a customizable air dam panel supported by the framework. A plurality of the frame pieces are provided to an installer for use in constructing the framework to fit the specific frame structure.

An acoustic-absorbing blanking panel for an electronics rack includes a sheet of acoustic-absorbing material mounted or mountable onto a front panel, the front panel being mountable onto an electronics rack. The blanking panel exhibits an absorption band at a frequency between 800 Hz and 12000 Hz. The sheet of acoustic-absorbing material may be mounted onto a frame, the frame being mountable onto a server rack. The sheet of acoustic-absorbing material may include acoustic-absorbing film, non-woven material, foam, or a panel with a core having a honeycomb structure. An electronics server rack includes a rack with mounting rails, constructed to house electronics components. An acoustic-absorbing blanking panel is mounted on the mounting rails. The blanking panel includes a sheet of acoustic-absorbing material mounted onto a front panel, the front panel being mounted onto the rack. The blanking panel has an absorption band at a frequency between 800 Hz and 12000 Hz.

A server chassis including rack and mount cage. Mount cage includes cage part and handle. Cage part is fixed on a side of the rack. Handle includes pivot part, handheld part, and protruding part. Handheld part and protruding part are respectively connected to two opposite sides of pivot part, and pivot part is pivotally connected to cage part. Protruding part has first side surface located on a side of protruding part that is located away from pivot part. An axis of pivot part is spaced apart from first side surface by first distance along first direction. Pivot part is spaced apart from first side surface by second distance along second direction. First direction is different from the second direction, and first distance is different from second distance.

A holder for connecting a rack manifold of an electronic rack and a room manifold of a data center room to provide liquid cooling to the electronic rack includes an L-shaped frame with a first arm having a first end and a second end, and a second arm extending from the second end of the first arm and substantially perpendicular to the first arm. The holder additionally includes a pivot point to be coupled to a pivot connector on a panel to pivotally move the L-shaped frame between a first position and a second position. The holder further includes a first blind-mate connector disposed on the L-shaped frame to be coupled to a second blind-mate connector at an engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the L-shaped frame moving to the second position in response to contact with the electronic rack.

Exemplary embodiments are directed to equipment cabinets for customized improved cable management and airflow management. The equipment cabinets include a frame structure. The frame structure includes a top frame assembly and a bottom frame assembly. In some embodiments, the equipment cabinets include a chimney assembly. In some embodiments, the equipment cabinets include a slidable vertical rail. In some embodiments, the equipment cabinets include a rotatable top panel. In some embodiments, the equipment cabinets include a condition monitoring assembly. In some embodiments, the equipment cabinets include a reinforced corner construction. In some embodiments, the equipment cabinets include divider panels capable of being split. Embodiments are also directed to methods of equipment cabinet assembly.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

A space-saving locking structure without sharp edges for a server cabinet can lock a first housing to a second housing and includes first and second locking members. The first locking member includes a locking portion with a tail portion, the second locking member includes a blocking portion. The blocking portion has a rounded surface such that when the first housing is pressed along a first direction, the first housing approaches and closes with the second housing, the tail portion being set against a top of the blocking portion. When the first housing is further pushed in a second direction, the tail portion slides along the rounded surface of the blocking portion until the tail portion abuts against the blocking portion to lock the first housing to the second housing.

A chassis includes a cage. The cage includes a body, a clamping member, and a buckling member. The body includes a first sliding portion, a fastening portion, and an accommodating area. The accommodating area includes a guide rail portion. The guide rail portion and the first sliding portion are disposed on two sides of the accommodating area, respectively. The fastening portion is disposed on one side of the accommodating area away from the guide rail portion. The clamping member is slidably disposed on the first sliding portion. The buckling member is disposed on the clamping member. The buckling member is adapted to be in contact with the fastening portion.

An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.