Described herein is a server that includes a server chassis having a front window for providing access to an interior receptacle of the server chassis. A docking station is located in the interior receptacle. The server also includes a PCIe module coupled to the docking station by a coupling element. The PCIe module protrudes externally from the interior receptacle through the front window in the docked position. The PCIe module can be moved to a plurality of undocked positions while remaining coupled to the docking station.

An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

A method of at least partially filling a gap between adjacent elements in a data center having a hot aisle and a cold aisle to decrease air leakage between the hot aisle and the cold aisle through the gap is provided. The method includes providing a gap filler having a compressible material and an outer layer having an outer surface and an inner surface. The inner surface defines a sealed inner space and the outer layer encapsulates the compressible material in a compressed state within the inner space. The method also includes placing the gap filler in the gap between the adjacent elements in the data center and at least partially releasing a seal within the outer layer to allow air to flow into the inner space of the outer layer to permit the compressible material to expand from the compressed state within the inner space of the outer layer to an expanded state within the inner space of the outer layer, thereby at least partially filling the gap between the adjacent elements in the data center.

An apparatus comprising a module, a hook assembly coupled to the module and configured to be rotated from a deployed position to a storage position when the module is fully inserted into a chassis and a spring coupled between the module and the hook assembly, wherein the spring is configured to extend the hook assembly from the storage position to the deployed position when the module is not fully inserted into the chassis.

In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282, 782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).

An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

An electronic equipment enclosure includes a frame structure and at least one panel secured to the frame structure. The at least one panel includes one or more panel knockouts arranged therein. Each panel knockout is configured to be removable from the at least one panel to provide a pass-through opening for a cable. The at least one panel further includes a split brush assembly seated in place of a removed one of the one or more panel knockouts.

A second modular mount rack frame for storing devices is described herein. One mount rack frame can comprise two modular rigid support structures in which bolts reversibly insert to laterally increase or decrease the horizontal dimension available for a computer related device. Rigid modular support structures stack, align vertically, and mechanically attach to each other to increase storage in a vertical dimension. A second modular mount rack frame can also exhibit wheels or coasters so the entire frame can smoothly and easily move across a flat supporting surface.

A rack server housing including a housing bottom with opposite side panels and first through third cover elements. The first and second cover element each have one similar fastening recess and are fixed to the side panels. The two fastening recesses are arranged point-symmetrically to one another. The third cover element is insertable into the first and second cover elements in such a way that in a first state in each case one engagement element of the cover element is arranged in a respective fastening recess and the third cover element can be slid from the first state to a second state both along a first direction and a second direction opposite said first direction, so that the third cover element takes at least a form-fit connection to the first and the second cover element via the engagement elements.

A server device having a plurality of server modules and a plurality of cooling fans in a chassis includes: a management unit configured to control the server modules; and a temperature measurement part configured to perform measurement of temperatures of the server modules. The management unit is configured to decide a server module to run on a basis of a result of the measurement by the temperature measurement part.