A heatsink with an air-partitioning baffle. In one embodiment, the heatsink comprises a plurality of fins defining a plurality of channels, an inlet channel that is at least partially defined by the plurality of fins and extends across the plurality of channels, and a baffle at least partially within the inlet channel. The baffle is configured to direct a first fluid flow, such as warm air, from a first portion of the plurality of channels and to direct a second fluid flow, such as cooling air, through at least one inlet of the inlet channel to a second portion of the plurality of channels.

Apparatus for use in electronic equipment includes a cap of nonconductive material positioned to collect and retain metallic particles produced by installation of metallic fasteners during assembly of the electronic equipment.

An antenna device may include: a main housing configured to house and fix a first board having a plurality of heating elements mounted on a rear surface thereof; at least one U-shaped heat dissipation cluster detachably coupled to the rear surface of the main housing, and filled with a predetermined refrigerant, wherein the refrigerant receives heat from the heating elements and dissipates the heat to the outside while moving along a pattern flow path formed in a distributed manner toward the outside; and at least one heat-collection mediating fixing part configured to collect heat from the heating elements and transfer the collected heat to the U-shaped heat dissipation cluster, while mediating the attachment/detachment of the U-shaped heat dissipation cluster to/from the rear surface of the main housing.

A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

An electronic assembly includes a first printed wiring board (PWB) on a first side of the electronic assembly, and a first stiffener secured to the first PWB. The electronic assembly also includes a second PWB on a second side of the electronic assembly, opposite the first side, a second stiffener secured to the second PWB, and a center stiffener seated in the second stiffener and between the first stiffener and the second stiffener. The center stiffener has a first side facing the first stiffener, a second side that is opposite the first side and facing the second stiffener, a first end, and a second end, opposite the first end. Electronic devices are secured to the center stiffener. The center stiffener dissipates heat from the electronic devices, and the electronic devices include power dies.

A post for mounting a camera comprises a base, a tube mast, and a camera mount arranged to hold one or more cameras. A proximal end of the tube mast is connected to the base and a distal end of the tube mast is connected to the camera mount. The invention is characterised in that the base is arranged to comprise computing equipment, from which computing equipment wiring runs through the tube mast to the camera mount, and in that the base and computing equipment are encased by a cabinet configured to protect the computing equipment from exposure to weather. The invention also relates to a method for installing a post.

A device includes a hybrid heat sink, and a heat generation component. The hybrid heat sink is attached to the heat generation component. The hybrid heat sink includes a front plate and a rear plate. The front plate is connected to the rear plate by a wall. The front plate includes fins extending away from the front plate and toward the rear plate.

An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

An information handling system includes a computing component that is sensitive to corrosion; and a chassis in which the computing component is disposed. The chassis receives an airflow used to thermally manage the computing component, and expels the airflow after thermally managing the computing component. The information handling system also includes an environmental control component that reduces a condensation formation propensity of a portion of the airflow that traverses the chassis proximate to the computing component.

A data center, an air handling system, and a method for installing equipment in a data center enable internal differential pressure relief within the data center. A volumetric container has mounting location(s) for heat generating information technology (IT) component(s) positioned within the volumetric container. A cold aisle on one side and a hot aisle on another side of the IT component(s) that have air passages for air cooling. A cooling unit is coupled to the volumetric container to pressurize the cold aisle with supply air and draws return air from the hot aisle. An air barrier is attached across an air passage between the cold and the hot aisles. A differential pressure relief mechanism is attached to the air barrier. The differential pressure relief mechanism is configured to open in responses to an air pressure difference across the differential pressure relief mechanism exceeding a pressure threshold.