An apparatus includes a chimney cooler having a housing. The housing includes a base and sidewalls. The base is configured to support one or more heat-generating components. The sidewalls extend from the base, and each sidewall includes multiple channels. Each channel defines a serpentine flow path configured to receive a fluid coolant. The sidewalls may be lofted away from the heat-generating component(s) as the sidewalls extend from the base. An inlet for each channel may be contoured to promote inertial flow of the fluid coolant into the serpentine flow path. An outlet for each channel may be contoured to promote inertial flow of the fluid coolant exiting the serpentine flow path. Channels at and adjacent to primary objective surfaces of the housing may share a common inlet. The channels at the primary objective surfaces of the housing may have larger outlets relative to the channels adjacent to the primary objective surfaces of the housing.

A transducer module and electronics device are disclosed. The transducer module comprises: a transducer member; and a housing, wherein the transducer member and the housing form a cavity, and at least two venting holes are provided in the housing and communicate the cavity with outside.

A case (2) includes a tubular body (6) extending vertically and a top plate (8) disposed at a top edge of the tubular body (6), the case being capable of accommodating a heat-generating element (5). Upward ventholes (16) for discharging the heated air (P), which is heated by the heat-generating element (5), to the outside are formed in the top plate 8. A partition wall (17) that protrudes downwardly from the top plate (8) is disposed between the upward ventholes (16) and the tubular body (6). An air accumulating part (20) surrounded by the tubular body (6), the top plate (8), and the partition wall (17) is formed.

Proposed is an electronic apparatus with which it is possible to increase design freedom concerning a wall section formed with vent holes. A rear wall section (20D) includes a rectilinear wall section (21i) spaced rearward from a rear edge (41c) of a circuit board (41), and an inclined wall section (21j) located on the rear side relative to the rectilinear wall section (21i). An inner wall section (42e) is located between the inclined wall section (21j) and the rear edge (41c) of the circuit board (41), and is not located between the rectilinear wall section (21i) and the rear edge (41c) of the circuit board (41).

A heat dissipation device includes a housing assembly, a sliding assembly, and a linkage assembly. The housing assembly includes a receiving cavity and a cooling hole communicating with the receiving cavity. The sliding assembly includes a sliding member and a rack. The sliding member is located in the receiving cavity and slidably connected to a side of the housing assembly with the cooling hole, the rack is fixedly connected to the sliding member. The linkage assembly includes a rotating shaft and a gear. The rotating shaft and the gear are located on the same side of the sliding member, the rotating shaft is fixed on the housing assembly and extends through the gear, the gear is rotatably sleeved on the rotating shaft and is engaged with the rack to drive the sliding member to slide, thereby adjusting an area of the cooling hole blocked by the sliding member.

Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.

Techniques arrange a disk, a storage device, and a disk array. Such techniques involve: a bracket configured to be detachably coupled to a rack; and a button arranged in the bracket and configured to be movable under the action of an external force to decouple the bracket from the rack, wherein a first end of the button is configured to be operated by a user, and the end surface of the first end includes a first surface and a second surface, the second surface extending from the first surface towards a second end, opposite to the first end, of the button. Accordingly, such techniques not only can avoid accidental touch, improve heat dissipation efficiency, and provide a mark area, but also can help prevent loss of user data in a storage device and a disk array.

A new approach is proposed to support fan-less thermal mitigation for an industrial-grade appliance. The industrial-grade appliance may comprise a plurality of hardware components that are major sources/regions of heat production in the industrial-grade appliance. Under the proposed approach, a heatsink is included in the industrial-grade appliance to address heat dissipation for all of the major sources/regions of heat production positioned on a main board of the industrial-grade appliance. The heatsink is specifically designed to have a plurality of surfaces that are in contact with all of the major heat-producing components of the industrial-grade appliance, wherein each of the plurality of surfaces of the heatsink has a maximum overlapping surface area with at least one of the major heat-producing components in order to transfer maximum amount of heat through conduction. Under the proposed approach, the heatsink is fan-less wherein no fan is used for heat dissipation.

An electronic control device capable of improving cooling performance by air cooling is provided.

The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.

An electronic device is provided. The electronic device includes a housing having an insertion slot, a connecting interface, and an adaptor card. The connecting interface is disposed in the housing for connecting with a first electronic module or a second electronic module separately and has a first connecting part and a second connecting part. The adaptor card is detachably disposed in the housing and includes a flow guide. When the electronic device is in a first mode, the first electronic module is connected to the first connecting part, and the adaptor card is disposed between the insertion slot and the connecting interface. The flow guide directs an airflow toward the first electronic module. When the electronic device is in a second mode, the adaptor card is removed from the housing, and the second electronic module is connected to the first connecting part and the second connecting part.