A communication system having a circuit board with an airflow opening includes a receptacle cage configured to be mounted to the circuit board adjacent a communication connector. The receptacle cage has walls including a front wall, a rear wall and sidewalls defining a cavity. A module channel is defined in the cavity configured to receive a pluggable module. The module channel has a module port at the front wall that receives the pluggable module. An airflow channel is defined by at least one of the walls of the receptacle cage located between the module channel and the circuit board. The airflow channel is configured to be in flow communication with the airflow opening in the circuit board for cooling the pluggable module in the module channel. The airflow channel has an airflow port at the front wall.

A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

Embodiments of the invention are related to modular display panels. In one embodiment, a modular display panel includes a first side which includes a display surface, and an opposite second side. The modular display panel further includes a plastic enclosure including an outer surface that forms substantially all of the second side. The modular display panel further includes LEDs arranged as pixels attached to a printed circuit board which is attached to the plastic enclosure. The modular display panel further includes a circuit for controlling the LEDs and a power source for powering the LEDs. The front side of the printed circuit board is sealed to be waterproof and the plastic enclosure is sealed to be waterproof so that the modular display panel is sealed to be waterproof.

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

A docking station has a base, a main casing, a cover body, a ventilation layer, and multiple first lateral openings. The main casing forms a first inner space and has multiple first through-holes. The ventilation layer is in gaseous communication with the first inner space via the first through-holes. The cover body is fixed to the main casing, and the ventilation layer is formed between the cover body and the main casing. The first lateral openings are formed in the cover body and in gaseous communication with the ventilation layer. When in use, heat generated by electronic components inside the first inner space makes air inside the first inner space flow upwards to the ventilation layer and subsequently exits the docking station via the first lateral openings. Meanwhile, cool air enters the first inner space via the first lateral openings to dissipate heat.

In a display device, a flow path for an airstream that flows from a lower air vent toward an upper air vent along a circuit substrate, based on generated heat from a circuit component is defined so as to face a back surface of a display panel in a housing. The flow path is defined such that a sectional area of the flow path varies along the circuit substrate.

The present disclosure provides a display apparatus. The display apparatus includes a display module including a display panel and a guide plate, a flexible printed circuit board extending from the display panel, a source printed circuit board connected to the flexible printed circuit board and attached to the guide plate, at least one driving chip disposed on the source printed circuit board, and a protective member disposed to cover the flexible printed circuit board, the source printed circuit board, and the driving chip.

A case (2) includes a tubular body (6) extending vertically and a top plate (8) disposed at a top edge of the tubular body (6), the case being capable of accommodating a heat-generating element (5). Upward ventholes (16) for discharging the heated air (P), which is heated by the heat-generating element (5), to the outside are formed in the top plate 8. A partition wall (17) that protrudes downwardly from the top plate (8) is disposed between the upward ventholes (16) and the tubular body (6). An air accumulating part (20) surrounded by the tubular body (6), the top plate (8), and the partition wall (17) is formed.

A thermodynamic heat exchanger is an electronic device having one or more heat generating devices, a heat exchanging element, and one or more heat exhaust elements. The heat generating devices can be the active and passive electronics elements included within a power conversion circuit, such as a power adapter used to charge a cellular telephone or other type of consumer electronics device. The heat exchanging element is configured to accept radiated thermal energy from the heat generating devices and distribute the accepted thermal energy across an outer surface to evenly distribute hot spots corresponding to the individual heat generating devices. The heat exchanging element is also configured to minimize heat radiating from its outer surface, thereby blocking heat in the thickness of the thermally conductive material.

A modular data center (MDC) has an air handling system that air cools a volumetric container and heat-generating equipment contained in externally attached equipment panels. Heat-generating information technology (IT) component(s) are positioned within the volumetric container with a cold aisle defined on one side and a hot aisle defined on another side of the IT component(s). The IT component(s) has air-cooling air passages that fluidly communicate between the cold and the hot aisles. A cooling unit pressurizes the cold aisle with supply air and draws return air from the hot aisle. The equipment panel(s) are externally attached to an exterior wall of the volumetric container. A supply air conduit directs supply air from the cold aisle into the equipment panel(s). A return air conduit directs air warmed by the heat-generating equipment inside the equipment panel into the hot aisle from the equipment panel(s) that receives the supply air.