H05K7/20136

SYSTEM AND METHOD FOR COOLING A COMPUTING DEVICE
20230023542 · 2023-01-26 ·

A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.

SYSTEM AND METHOD FOR A RADIO MODULE ON PREMISE OF A COOLING FAN
20230232569 · 2023-07-20 · ·

An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU) operatively coupled to the processor; a cooling fan operatively coupled to the processor to draw air into and direct air out of a base chassis of the information handling system, the cooling fan including a fan housing; and a radio module operatively coupled to the fan housing to be cooled by conduction to the fan housing and operation of the fan via convective cooling.

Passive and active environmental management of an information handling system

An information handling system includes a plurality of computing devices, and at least one environmental management unit external to the plurality of the computing devices and configured to manage an internal environment of the information handling system.

HEAT DISSIPATION MODULE AND PROJECTION DEVICE
20230020100 · 2023-01-19 · ·

A heat dissipation module, including a fan and a heat dissipation fin set, is provided. The fan has an air outlet side and an air inlet side opposite to each other. The heat dissipation fin set is configured at the air outlet side and includes a base, first heat dissipation fins, and second heat dissipation fins. The base is divided into a first area and a second area along a direction of a rotation axis of the fan. The first area is located between the air outlet side and the second area. The first heat dissipation fins are connected to the base and located in the first area, and arranged at equal intervals in a configuration direction perpendicular to the direction of the rotation axis. The second heat dissipation fins are connected to the base and located in the second area, and arranged at equal intervals in the configuration direction.

MITIGATING FAN NOISE IN HDD STORAGE SYSTEM

Examples are disclosed that relate to attenuating fan noise in a computing storage system comprising magnetic data storage devices. One example provides a computing storage system comprising an enclosure, a plurality of magnetic data storage devices positioned within the enclosure, one or more fans positioned to cool the magnetic data storage devices, and an acoustic attenuator located between the plurality of magnetic data storage devices and the one or more fans. The acoustic attenuator comprises a plurality of airflow channels each defined by one or more internal walls of the acoustic attenuator, wherein at least one of the plurality of airflow channels is configured to block a line of sight between the plurality of magnetic data storage devices and the one or more fans.

CIRCUIT APPARATUS FOR ELECTRONIC DEVICES
20230017925 · 2023-01-19 ·

Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

Card Cage System for Hybrid Cooling of Computer Circuit Cards
20230221780 · 2023-07-13 ·

Disclosed herein is a computer circuit card cage system configured to house one or more computer circuit cards. The computer circuit card cage system can comprise a housing comprising one or more walls having one or more apertures formed therein. The computer circuit card cage system can further comprise one or more support rails supported on one or more of the walls and configured to support a computer circuit card. The one or more support rails can have one or more apertures formed therein to facilitate flow of a fluid through the one or more support rails. The flow path of the fluid is through the one or more apertures in the walls of the housing, and the one or more apertures in the support rails.

SYSTEM AND METHOD FOR A 5G COOLING MODULE THAT DIRECTS HEAT INTO A THERMAL LOOP ASSOCIATED WITH A PROCESSING DEVICE
20230225083 · 2023-07-13 · ·

An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

MOBILE HIGH PERFORMANCE COMPUTING PLATFORM FOR CRYPTOCURRENCY MINING

A self-contained mobile high performance computing platform for cryptocurrency mining is disclosed. The self-contained mobile high performance computing platform includes a mobile cabinet, which includes wheels for easy movement and placement within, for example, a warehouse facility, a garage, a basement, an office tower, or a vehicle such as a truck or van. The cabinet is configured to enclose at least one computing apparatus, which includes computing blades immersed in an oil or other dielectric fluid for immersion cooling. The computing blades are configured to be connected to respective interface boards via connectors that are located within a tank of the dielectric fluid. Each computing blade may be individually removed or replaced, thereby enabling an inoperable or low performance computing blade to be disconnected without affecting the operations of the other computing blades.

INSERT TO REPLACE A FAN IN HYBRID LIQUID COOLING OF AN INFORMATION HANDLING SYSTEM
20230221781 · 2023-07-13 ·

An information handling system includes a first set of components, a second set of components, and a hybrid cooling system. The hybrid cooling system includes a fan structure, a liquid cooling system, and a fan insert. The fan structure includes multiple cooling fans to provide air cooling to the first components of the information handling system. The liquid cooling system provides liquid cooling to one or more of the second components. The liquid cooling system includes a first liquid line routed through an empty fan cavity of the fan structure. The fan insert is located within the empty fan cavity and provides a seal against air-bypass and recirculation within the information handling system.