An air conditioner for an enclosure that can include a housing that partly defines an ambient air exchange cavity and a tub that further defines the ambient air exchange cavity and partly defines a cooling cavity. The tub can support a first heat exchanger within the ambient air exchange cavity, and a second heat exchanger and a fan within the cooling cavity. The second heat exchanger can be included in a coolant flow loop with the first heat exchanger and the fan can move air across the second heat exchanger and into the inlet of the enclosure. The second heat exchanger can be located above the fan. A fluid trap can be provided below the second heat exchanger and adjacent the fan to capture condensate from the second heat exchanger and can direct the condensate into the ambient air exchange cavity for disposal.

An environmental control system is provided. The environmental control system can include a cooling device and a heating device. The cooling device can lower the temperature of fluid contained within a cold reservoir and the heating device can raise the temperature of fluid contained within a hot reservoir.

The electric control box includes a box body, a mounting board, an electronic component, and a heat sink, the box body being provided with a mounting cavity; the mounting plate is disposed in the mounting cavity and the mounting cavity forms a first cavity and a second cavity located on the two sides of the mounting board; the electronic component is arranged in the second cavity; the heat sink comprises a heat exchange body and a header assembly; the header assembly is used for providing refrigerant flow to the heat exchange body; at least part of the heat exchange body is arranged in the first cavity, and is heat-conductively connected to the electronic component; the mounting board is used for blocking the condensed water on the heat sink from flowing into the second cavity.

A modular data center (MDC) includes a volumetric container comprising an enclosure having first and second exterior walls at a forward and an aft end, connected by lateral exterior walls. Information technology component(s) are positioned longitudinally within the container between a cold aisle and a hot aisle. An air handling system includes two or more air handling units (AHUs) each having a return air inlet and a supply air outlet. A supply air plenum directs cooling air flow from the supply air outlets to a supply air opening positioned adjacent to the cold aisle. Backflow prevention mechanisms are positioned respectively at each supply air outlet of the AHUs. Each backflow prevention mechanism is moveable into an open position to allow cooling air flow out of the supply air outlet of a corresponding AHU and a closed position in response to deactivation of an air mover of the corresponding AHU.

Configurations for exhaust baffles are disclosed. In at least one embodiment, one or more baffles direct an outlet air flow from a heat exchanger.

Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

A control-cabinet system has a base module and at least one functional module. The base module has a base housing with a first housing face and a second housing face. The functional module has a functional housing with a housing underside, where a circulation channel is arranged. Air flow may be circulated in the circulation channel, where each base connection element comprises circulation openings which are fluidically connected to the circulation channel. The functional connection element comprises coupling openings fluidically connected to an interior of the functional housing. The coupling openings are coupleable to the circulation openings, in which a fluidic connection exists between the circulation channel and the interior of the functional housing. A fluidically closed circulation circuit comprising the circulation channel and the interior of the functional housing is formed, in which air flow may be circulated.

A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.

This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.

The present disclosure provides a display. The display includes a display module, a supporting plate, and an evaporator. The display module has a front surface and a rear surface opposite the front surface of the display module. The supporting plate is attached to the rear surface of the display module. The evaporator is attached to the supporting plate and thermally connected to the rear surface of the display module through the supporting plate.