A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

A thermal control system includes an enclosure configured to contain a thermal mass. A baffle plate is disposed in the enclosure. A heat exchanger is coextensive with and cooperates with the baffle plate to divide the enclosure into a first chamber and a second chamber. An air circulation element cooperates with the baffle plate and the heat exchanger to define an air circulation path and to cause air to flow through the air circulation path. The heat exchanger exchanges thermal energy with the air flowing through the air circulation path.

A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Disclosed is an air conditioning arrangement, in particular a cooling arrangement, at least comprising a switchgear cabinet (1) that has a supporting device (4). Electric and/or electronic devices (2) that are to be air-conditioned are disposed in rows on top of and next to one another on the front side (17) of the supporting device (4), said front side (17) facing the doors of the switchgear cabinet. The disclosed air conditioning arrangement is characterized in that the devices (2) in the switchgear cabinet (1) can be at least partially air-conditioned by at least one heat sink (50), each of which forms an autonomous component.

An optical measurement stability control system includes a case, a circulating flow field, an optical measurement system and a heat dissipation flow field. The case has an airtight space. The circulating flow field is located in the airtight space and adapted to generate an airflow flowing in the airtight space. The optical measurement system is located in the airtight space and located on a flow path of the airflow. The heat dissipation flow field is connected to the case and located at an end of the flow path. The heat dissipation flow field discharges heat out of the airtight space by heat conduction and forced convection.

An electronic display has a housing with different regions and a display panel with a display surface. A cooling module flows internal coolant through the cooling module and the regions. The cooling module has a crossflow heat-exchanger and side walls. The regions and cooling module have an coolant inlet and outlet. The coolant inlets of the regions communicate with the coolant outlet of the cooling module. The coolant outlets of the regions communicate with the coolant inlet of the cooling module. The regions have their own circulating loop of coolant, with flow of coolant being deflected from the outlet of the cooling module towards the coolant inlets of the regions, and flow of coolant from the coolant outlets of the regions being deflected towards the coolant inlet of the cooling module. The coolant flows in parallel over both front and back of the display panel.

An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

A system, according to one embodiment, includes: a first frame of an automated tape library, wherein an interior of the first frame includes one or more tape drives, an area for storing tape cartridges, and an accessor channel, and a first air conditioning unit coupled to the first frame. The first air conditioning unit is configured to cool the interior of the first frame. Moreover, one or more fans of the one or more tape drives are configured to generate air flow within the interior of the first frame. Other systems, computer-implemented methods, and computer program products are described in additional embodiments.

An embodiment provides a method, including: receiving, from a temperature sensor disposed within an electronic device, temperature input relative to a first heat generating component; the first heat generating component being upstream of a cooling element of the electronic device; receiving, from a temperature sensor disposed within an electronic device, temperature input relative to a second heat generating component; the second heat generating component being downstream of the cooling element; and controlling the cooling element to cool the first and second heat generating components based on both the temperature input relative to the first heat generating component and the temperature input relative to the second heat generating component. Other aspects are described and claimed.

Cable channel apparatus are provided that may be employed for routing system cables through open spaces defined within chassis walls, barriers or other fixed surfaces that separate different compartments or areas of an information handling system chassis. The cable channel apparatus may form a seal around the inserted system cables that prevents recirculation of cooling air through the open spaces between the different compartments. In one example, the cable channel apparatus may be employed to form such a seal around system cables that are routed through an open space to pass though or around a fan gantry that is mounted within a chassis of an information handling system chassis.