A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A self-contained mobile high performance computing platform for cryptocurrency mining is disclosed. The self-contained mobile high performance computing platform includes a mobile cabinet, which includes wheels for easy movement and placement within, for example, a warehouse facility, a garage, a basement, an office tower, or a vehicle such as a truck or van. The cabinet is configured to enclose at least one computing apparatus, which includes computing blades immersed in an oil or other dielectric fluid for immersion cooling. The computing blades are configured to be connected to respective interface boards via connectors that are located within a tank of the dielectric fluid. Each computing blade may be individually removed or replaced, thereby enabling an inoperable or low performance computing blade to be disconnected without affecting the operations of the other computing blades.

An electronic equipment chassis comprises a chassis housing and two or more cooling compartments in the chassis housing. At least a first one of the two or more cooling compartments in the chassis housing utilizes a first type of cooling for a first set of electronic equipment housed therein, and at least a second one of the two or more cooling compartments in the chassis housing utilizes a second type of cooling for a second set of electronic equipment housed therein. The first type of cooling comprises liquid immersion cooling and the second type of cooling comprises non-liquid immersion cooling.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A container data center is provided. The data center is provided in a shipping container, and the container data center includes a cooling system including a plurality of cooling devices for cooling the data center; a power supply and distribution system including a power supply circuit for supplying power to the data center; and a control system electrically connected to the cooling system and the power supply and distribution system; wherein the control system comprises a plurality of control devices, the plurality of control devices each configured to control a part of the cooling devices, and when a first part of the plurality of control devices cannot work, a working mode of a second part of the control devices is adjusted to control the plurality of the cooling devices.

Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.

In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.

Embodiments are disclosed of an information technology (IT) cooling system. The system includes an IT container having an internal volume. Inside the internal volume there is an immersion fluid region adapted to submerge one or more servers in a two-phase immersion fluid. An immersion condenser is positioned above the immersion fluid region in the internal volume. The design includes a circulation condenser. The circulation condenser is fluidly coupled to a liquid distribution manifold and a vapor return manifold that are positioned in the internal volume above the immersion tank (i.e., the immersion fluid region) and are adapted to circulate a two-phase circulation fluid. The circulation condenser is also fluidly coupled to the immersion condenser, and an external cooling fluid is pumped from the circulation condenser to the immersion condenser. The distribution manifolds are adapted to be fluidly coupled to the server liquid cooling loops.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.