The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.

A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

A system for immersion cooling electronic components includes a cylindrical container having a circular cross section, a cooling element disposed in the cylindrical container and containing a first cooling fluid, and a volume of a second cooling fluid disposed in the cylindrical container and in contact with the cooling element for exchange of heat between the second cooling fluid and the first cooling fluid, the second cooling fluid comprising an immersion cooling fluid. A heat generating electronic component is disposed within the cylindrical container and at least partially immersed in the second cooling fluid for exchange of heat between the electronic component and the second cooling fluid, and a fluid circulating device is disposed in the second cooling fluid to direct a flow of the second cooling fluid through the electronic component and over the cooling element.

A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.

An immersion cooling equipment includes an immersion cooling device, a heating component and a cooling liquid. The immersion cooling device includes a tank providing cooling by immersion and a liquid supply equipment. The tank providing cooling by immersion communicates with the liquid supply equipment and accommodates the heating component and the cooling liquid. The tank providing cooling by immersion includes a mounting bracket, a cooling box, and a sealing plate. The cooling box is positioned in the mounting bracket, the cooling box comprising a plurality of walls, the plurality of walls surround a reception space, the reception space comprising a first opening. The sealing plate is detachably connected or rotatably connected the cooling box, and is used to close or reveal the first opening. Each the walls is made of thermoplastic plastic, and any two abutting walls are fixed by plastic welding.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

The present invention provides a thermal management system comprising a housing having an interior space; a heat-generating component disposed within the interior space; a heat exchanger; and a working fluid liquid disposed within the interior space wherein the heat-generating component is in contact with the working fluid. The working fluid comprises a Fischer-Tropsch derived base fluid; an antioxidant and anti-static additives. The system is constructed wherein a constant cyclical flow of working fluid is maintained across the heat-generating components, on to the heat exchanger and then back to the heat-generating component.

The present invention provides a method of thermal management of a heat-generating component comprising partially immersing a heat-generating component in a working fluid and transferring the heat from the heat-generating component using the working fluid in a constant cyclical flow of working fluid across the heat-generating components, on to a heat exchanger and then back to the heat-generating component.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

A lid for a tank which is stably supported at various angles when open includes a tank or box, the lid, and at least one supporting component. The interior of the box contains components which are immersed in coolant for example, the lid allowing access thereto. The lid is rotatably connected to the box and covers or exposes the interior. The one or more supporting components are connected to the lid and the box. The lengths of the supporting components which stably support the lid at certain angles can be changed, which makes it convenient and risk-free for an operator to access the interior under the open lid. An immersion cooling system is also disclosed.