A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

A rack system for housing an electronic device comprises an immersion case configured to provide housing to the electronic device. The immersion case includes a first wall, and a second wall. The first wall and the second wall define means for controlling deformation of the immersion case, such that when an immersion cooling liquid is inserted in the immersion case, the means for controlling deformation limit the deformation of the immersion case.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.

A cooling device includes: an inner tank configured to store a first coolant which is a liquid; a separation wall that is provided in the inner tank, that faces a side wall portion of the inner tank, that forms an accommodating portion in which an electronic device to be immersed in the first coolant is accommodated, and that forms, at at least part of a periphery of the accommodating portion, a coolant channel through which the first coolant is to flow toward a lower side of the inner tank; an outer tank which is disposed outside the inner tank and through which a second coolant flows; and a heat transfer unit that is provided between the inner tank and the outer tank and that is configured to transfer heat from the first coolant to the second coolant.

In some examples, a system uses ambient air from outside a controlled airflow environment to cool equipment within the controlled airflow environment. The system can include ductwork that seals the ambient air from air outside of the ductwork within the controlled airflow environment. The system can further include a passive heat exchanger connected to the equipment and extending into an interior of the ductwork to allow heat exchange between the equipment and the ambient air. The system can further include a fan to flow the ambient air through the ductwork, the fan being connectable to the equipment to allow the equipment to control the operation of the fan.

An electronic device includes: a heat generating component; a board disposed in a vertical direction, the heat generating component mounted on a first surface of the board; a first thermally conductive member superposed on a second surface of the board opposite the first surface of the board; a plurality of second thermally conductive members extending in a horizontal direction from a first surface of the first thermally conductive member; a third thermally conductive member facing the first surface of the board, the third thermally conductive member secured to the distal end portions of the plurality of second thermally conductive members; a housing including a first wall portion superposed on a second surface of the first thermally conductive member, and a second wall portion opposite the first wall portion; and a heat sink provided on an outer surface of the second wall portion.

A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.

A server heat dissipation structure, configured to dissipate the heat of a host casing of a dense type server. The server heat dissipation structure includes a thermosiphon heat sink and a fan assembly. The thermosiphon heat sink includes a heat absorbing end and a heat dissipation end that are connected via a connection tube. The fan assembly is disposed on a side of the heat dissipation end so as to help the heat dissipation of the heat dissipation end.

A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with one or more heat generating means. The system includes a plurality of first heat exchange circuits and second thermosyphon circuits. The overall configuration of the system being such that the second thermosyphon circuits are in fluid communication with each other according to a parallel connection.