A cooling system includes a first liquid cooling plate, a second liquid cooling plate, a communication structure, a first thermosiphon device, and a second thermosiphon device. The communication structure is disposed between the first liquid cooling plate and the second liquid cooling plate, and connects flow channels in the first liquid cooling plate and the second liquid cooling plate. The first thermosiphon device and the second thermosiphon device are both thermally coupled to the first liquid cooling plate and the second liquid cooling plate. The first thermosiphon device and the second thermosiphon device are located on opposite sides of the communication structure and between the first liquid cooling plate and the second liquid cooling plate.

The present invention is related to an immersive cooling unit (1), comprising at least one closed heating channel (2), defined by at least one circumferential heating channel wall having a start and an end, accommodating one or more printed circuit boards (10), comprising one or more heat dissipating electronic components (5), at least one closed cooling channel (3), defined by at least one circumferential cooling channel wall (6), wherein a start of the cooling channel (3) is connected to an end of the heating channel (2), and wherein an end of the cooling channel (3) is connected to the start of the heating channel (2) such that a closed circuit is formed between the channels (2,3), a liquid coolant, for cooling the electronic components (5), said coolant at least filling the channels (2, 3) and submerging the printed circuit board (10), wherein the channels (2, 3) each allow a coolant flow having at least a vertical component wherein at least a portion (7) of the cooling channel wall (6) is formed by a heat conducting material, said portion (7) allowing an exchange of heat between a part of the coolant in contact with an interior side of said cooling channel wall portion (7) and a surrounding (8) in contact with an exterior side of said cooling channel wall portion (7). The invention is further related to a cooling unit (1) and a holder (15), and a method for using the cooling unit (1).

A heat exchanger includes: a heat exchanger body, the heat exchanger body being provided with first micro-channels and second micro-channels; and a header assembly, including a first header and a second header. The first header is provided with a first header channel which is used for providing a first refrigerant flow to the first micro-channels and/or collecting a first refrigerant flow flowing through the first micro-channels, and the second header is provided with a second header channel which is used for providing a second refrigerant flow to the second micro-channels and/or collecting a second refrigerant flow flowing through the second micro-channels, and heat is exchanged between the first refrigerant flow flowing through the first micro-channels and the second refrigerant flow flowing through the second micro-channels.

A system for cooling an electronic component includes an enclosure, a radiator, a pump, a valve, and a tubing network. The enclosure is configured to house the electronic component and to permit a fluid to directly contact the electronic component. The valve selectively permits passage of the fluid to the pump. The tubing network circulates a fluid from the enclosure to at least one of the radiator, the valve, or the pump.

Methods, systems, and products for edge data center integrated geothermal cooling include an edge data center container including: computing equipment, and a heat exchanger coupled to the computing equipment via a thermosiphon; a fluid reservoir positioned underground below the edge data center container, wherein the fluid reservoir is configured for geothermal cooling; and a pump configured to circulate cooling fluid between the fluid reservoir and the heat exchanger.

A heatsink and a communication device having the heatsink are disclosed. The heatsink comprises a heatsink base and a plurality of heatsink fins. Each heatsink fin includes a fin bottom joined to the heatsink base and a fin top opposite to the fin bottom. A plurality of flow channels are formed in at least one of the heatsink fins to extend obliquely from the fin bottom towards the fin top. The plurality of flow channels merge into a public channel formed at the fin top.