An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

A coolant supplying module for supplying a coolant stored in a shared reservoir tank to an electrical component cooling circuit and a battery cooling circuit includes a main body connected to the shared reservoir tank, at least one water pump mounting portion formed at the main body to mount at least one water pump included in the electrical component cooling circuit and the battery cooling circuit, and a valve mounting portion formed at the main body to mount a coolant valve included in the battery cooling circuit.

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

Technologies for cooling conformal power delivery structures are disclosed. In one embodiment, an integrated circuit component has a die with a backside power plane mated to it. A lid of the integrated circuit component is mated with the backside power plane, forming a sealed cavity. The lid has an inlet and an outlet, and a channel is defined in the lid for liquid coolant to flow from the inlet, across the backside power plane, and to the outlet. The liquid coolant directly contacts the backside power plane, efficiently removing heat from the backside power plane.

A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

Disclosed is a water-cooling device for a solid-state disk, comprising: a water-cooling component, including a water block and a water pump disposed in the water block, the water block being provided with a heat conducting member to form heat conduction with the solid-state disk; a first pipe; a second pipe; and a water-cooling radiator component having a heat radiator, wherein the first pipe and the second pipe are connected between the radiator and the water-cooling component, the water pump is provided to drive cooling liquid to flow in a liquid circulating sequence of the water-cooling component, the second pipe, the water-cooling radiator component, the first pipe and the water-cooling component, and the heat radiator of the water-cooling radiator component is provided to transfer heat from the cooling liquid to the air.

The invention concerns an alveolar cooling structure (3) which is configured to dissipate the heat generated by at least one electronic component (40) placed on an upper surface (21) of a substrate (2), the alveolar cooling structure (3) being in contact with an inner surface (22) of the said substrate (2). The alveolar cooling structure (3) comprises cells, the cell edges of which increase a total contact surface between the alveolar cooling structure (3) and a cooling fluid; and pores which are defined by the cells and distributed in the volume of the alveolar cooling structure (3), the cooling fluid circulating through the pores and/or through the spaces between the pores.

Connectors for a networking device may be provided. A networking device may comprise a first plurality of switch bars each comprising a first switch type arranged parallel to one another, a second plurality of switch bars each comprising a second switch type arranged parallel to one another, and a third plurality of switch bars each comprising a third switch type arranged parallel to one another. The first plurality of switch bars, the second plurality of switch bars, and the third plurality of switch bars may be arranged orthogonally. A first one of the first plurality of switch bars may be connected to a first one of the second plurality of switch bars via a retractable mechanical connector mechanism.

A cooling capacity distribution unit includes a liquid-cooled circulating pump disposed in a cabinet, and a frequency converter that supplies power to the liquid-cooled circulating pump. The frequency converter includes an AC-DC module and a DC-AC module. The AC-DC module is configured to be connected to mains, and the DC-AC module is connected to the liquid-cooled circulating pump. The cooling capacity distribution unit further includes a power supply unit, where the power supply unit includes a backup battery disposed in the cabinet, and a DC-DC module connected to the backup battery. The DC-DC module is connected to the DC-AC module and is configured to supply power to the liquid-cooled circulating pump.