Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

A fluid device includes an assembly potion and a block portion. The assembly portion is for assembling with an object. The block portion is provided at the assembly portion, and is for blocking or guiding a fluid. Thus, the fluid device of the present disclosure is enabled to provide effects of a secure arrangement as well as effectively guiding or disturbing a fluid to dissipate heat.

Disclosed is a method for controlling a thermal regulation circuit of a vehicle, the circuit comprising first (2) and second (4) heat exchangers situated in series in a circulation direction of an air flow intended to pass through them in this order, the circuit further comprising an additional heat exchanger (16) situated upstream from the first heat exchanger (2) in the circulation direction of the air flow, the circuit being configured to allow the circulation of a refrigerant fluid in the first exchanger (2) and the circulation of a heat transfer fluid in the second exchanger (4) and in the additional exchanger (16), the method comprising a step of generating or increasing a flow rate of the heat transfer fluid in the additional exchanger (16) depending on operating modes of the circuit.

An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.

A cooling system and a cooling device are provided. The cooling device includes a container, a heat dissipation module, and a cooling module. The cooling module includes a cover plate and a heat dissipation fin assembly. The cover plate covers an opening of the container. The cover plate includes a cooling channel. The cooling channel is arranged in the cover plate and includes an inlet and an outlet. The inlet and the outlet are respectively located at two sides of the cover plate. One side of the heat dissipation fin assembly is in contact with a surface of the cover plate, and an other side of the heat dissipation fin assembly is located in the container. Through the above structure, a usage amount of heat transfer fluid injected into the container of the cooling device is lower than that of a conventional immersion cooling device.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.

A liquid-cooled plate radiator is disclosed. The liquid-cooled plate radiator includes a radiator body. A coolant liquid runner for circulating a coolant liquid is formed inside the radiator body. The coolant liquid runner includes a plurality of radiating sub-runners. Then, a plurality of fin units are arranged on the radiating sub-runners along a flow direction of the coolant liquid. The fin unit has a plurality of fins extending side by side along the flow direction of the coolant liquid. Moreover, the fins of the front and rear adjacent fin units on the radiating sub-runners are staggered, thereby increasing the radiating area, enhancing the disturbance of the coolant liquid when flowing inside the radiating sub-runners, and improving the radiating efficiency. Thus, the technical problems of limited radiating area and low radiating efficiency caused by a single linear coolant liquid runner are solved. The contact area between the liquid-cooled plate radiator and the coolant liquid is effectively improved, and the radiating efficiency is improved by increasing the disturbance of the coolant liquid. The structure is simple.

The present invention relates to a thermal ink jet printer capable of performing continuously by maintaining consistent print quality and optimum cartridge life. More particularly, the present invention relates to a print head assembly of a thermal ink jet printer comprising of a cooling system for ink inside the cartridge, an airtight chamber to prevent heat losses into atmosphere and prevents condensation of air from atmosphere.

A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.