A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

The disclosure provides a network equipment power supply and a heat dissipation system therefor. The heat dissipation system includes a liquid-cooling heat dissipation device and an air-cooling heat dissipation device. The liquid-cooling heat dissipation device includes a liquid inlet, a liquid outlet, and a liquid-cooling pipe between them, wherein liquid-cooling medium flows inside the liquid-cooling pipe and takes away heat generated by components arranged around the liquid-cooling pipe; The air-cooling heat dissipation device includes an air inlet, an air outlet, and an air-cooling channel between them, wherein airflow passes through the air-cooling channel and takes away heat generated by components arranged around the air-cooling channel. The disclosure conducts hybrid heat dissipation combining characteristics of liquid-cooling heat dissipation and air-cooling heat dissipation to effectively enhance heat dissipation efficiency, and provides a new choice for design of a power supply unit with high power density.

A cooling system includes a first module provided with a substrate, a heat generating member, and a cooling member, a second module provided on a first side of a housing in a depth direction with respect to the first module and provided with a substrate, a heat generating member, and a cooling member, an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module, and a discharge tube configured to discharge the cooling medium passed through the first module and the second module.

An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.

Example implementations relate to a leak mitigation (LM) system. The LM system may include a collection tank, a first valve unit coupled to the collection tank, a second valve unit coupled to a cooling loop carrying a coolant, and an LM pump coupled between the first valve unit and the second valve unit. Moreover, the leak mitigation system may also include a controller operatively coupled to the first valve unit, the second valve unit, and the LM pump to operate, in an event of a leak of the coolant from the cooling loop, the first valve unit, the second valve unit, and the LM pump to transfer at least a portion of the coolant to the collection tank from the cooling loop via the second valve unit and the first valve unit.

A liquid cooling distribution system can be installed to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The liquid cooling system can include a fluid manifold and a container that is arranged to capture a fluid that leaks from the fluid manifold. A first fluid sensor can be arranged to detect the fluid at a first position in the container. A controller can be configured to reduce a flow of the fluid into the fluid manifold and pump out fluid from the fluid manifold, in response to the fluid in the container being detected at the first position. Further remedial measure can be taken based on various detected leak scenarios.

Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.

An adopting core device including a main board, a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In an embodiment, a main board including a fluid channel assembled by a manual mating connector through hoses and a blind mating connector fixed on the other side. In an embodiment, the manual mating connector is connected to a rack connector of a rack manifold of an electronic rack coupled to an external cooling fluid source to receive and to return cooling fluid from and to the external cooling fluid source. For example, the blind mating connector is capable of being engaged with or disengaged from a server fluid connector of a server chassis. In an embodiment, the server chassis comprises a leaking sensor configured to detect leakage of the cooling fluid within the server chassis.