Patent classifications
H05K7/20272
Disconnects
A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.
ENHANCED INFORMATION HANDLING SYSTEM COMPONENT IMMERSION COOLING VIA PUMP RETURN CONNECTION
Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.
IMMERSION COOLING OF INFORMATION HANDLING SYSTEMS WITH ON-NODE BOOST PUMPS
Information handling system (IHS) component immersion cooling systems and methods may employ a cold plate disposed on one or more IHS components of an IHS disposed in an immersion cooling tank and an immersible immersion fluid pump adapted to be deployed in the immersion cooling tank, the immersible immersion fluid pump in fluid flow communication with the cold plate, directing flow of immersion fluid in the immersion cooling tank to the cold plate. The immersible immersion fluid pump may be disposed on the cold plate or in an equipment bay of the IHS. A manifold may distribute flow from first and/or second immersible immersion fluid pump(s) to first and second cold plates. Power, etc. may be provided to the immersible immersion fluid pump via (a) fan connection(s) provided by the IHS. Tubing may extend from an outlet of the cold plate away from other components of the IHS.
METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE COOLING DEVICE
Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.
INTEGRATED LIQUID-COOLED HEAT DISSIPATION DEVICE
The present invention relates to the technical field of liquid-cooled heat dissipation, and in particular to an integrated liquid-cooled heat dissipation device. The heat dissipation device includes a first water chamber, a pumping device and a first interface. The first interface is mounted on one side of the first water chamber. The pumping device is provided in an embedded manner in the first water chamber, and the pumping device includes a water pump water chamber which is in communication with the first interface and an interior of the first water chamber. An objective of the present invention is to provide an integrated liquid-cooled heat dissipation device, which, through the rational design of a pumping device and a heat dissipation device, solves the problem that the integrated pumping and dissipation structure cannot meet the general space requirements.
COOLER AND SEMICONDUCTOR DEVICE
A cooler includes: a cooling wall including a first surface and a second surface; a first path extending in a first direction and having an inlet for a refrigerant; a second path extending in the first direction and having an outlet for the refrigerant; a cooling path causing the first path to communicate with the second path in a second direction intersecting the first direction; a partition spaced from the cooling wall in a third direction perpendicular to the first surface, separating the first and second paths from the cooling paths, and including a third surface constituting a part of a wall surface of the first path, the third surface including a first portion and a second portion differing from the first portion in position in the third direction. The first path includes a first gas retaining space defined by the first and second portions.
WATER COOLING RADIATOR
A water cooling radiator includes a first radiator having a liquid tank, first liquid return tank, first inlet radiator portion, and first outlet radiator portion. The first inlet radiator portion is adjacent to the first outlet radiator portion and both are between the liquid tank and first liquid return tank. The first inlet radiator portion includes at least one first inlet pipe thermally coupled to at least one first inlet heat dissipating fin. The first outlet radiator portion includes at least one first outlet pipe thermally coupled to at least one first outlet heat dissipating fin. A first inlet temperature of a liquid coolant at a first inlet fluid input end is greater than a first return temperature of the liquid coolant at a first outlet fluid input end. A pitch measurement of a first inlet fin pitch is greater than a pitch measurement of a first outlet fin pitch.
SCREW-TYPE PUMPING DEVICE AND LIQUID-COOLED HEAT DISSIPATION DEVICE
The screw-type pumping device includes a water pump shell, a stator and a rotor. The water pump shell is provided with a first cavity for accommodating the stator and a second cavity for accommodating the rotor. At one end close to the second cavity, the water pump shell is provided with an outwardly-extending water pump water chamber, the water pump water chamber is internally provided with a screw configured to rotate coaxially with the rotor, and the water pump water chamber is provided with a first water port and a second water port which are in communication with the water pump water chamber. An objective of the present invention is to provide a screw-type pumping device and a liquid-cooled heat dissipation device. The newly designed screw-type pumping device can output higher hydraulic pressure while having a smaller vibration during high-speed rotation and a prolonged service life.
Server rack with leak protection and detection
A liquid cooling system can be installed to an information technology (IT) rack. The liquid cooling system can include a cooling assembly that has a cooling chassis and cold plates fixed at a bottom portion of the cooling chassis. Fluid lines are arranged in an interior of the cooling chassis to fluidly connect the cold plates to a supply line and a return line. The cooling chassis includes an outlet port that provides a path for a leaked fluid to flow out of the cooling chassis. The outlet port is inserted into an opening of a detection channel that has one or more fluid sensors within the detection channel. The floor of the cooling chassis may have a shape or other features to assist flow of leaked fluid towards the outlet port to assist in depositing the leaked fluid in the detection channel.
FLOW PATH MODULE, COOLANT DISTRIBUTION DEVICE, AND SERVER
A flow path module, adapted to a heat exchange element and a coolant and including a pipeline structure and at least one flow resistance element, is provided. The pipeline structure is adapted to be connected to the heat exchange element. The flow resistance element is disposed in the pipeline structure, and the coolant flows through the heat exchange element from the pipeline structure. A flow resistance of the flow resistance element is adapted to be adjusted corresponding to a flow resistance of the heat exchange element. A coolant distribution device and a server are also provided.