A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.

A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.

A thermal management plate includes two cooling devices. A first cooling device includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The second cooling device also includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The channels of the first cooling device and the channels of the second cooling device are in thermal communication with one another, and the two channels are designed jointly.

An electronic rack cooling system is disclosed that includes both a two-phase cooling system having a first cooling loop and a single-phase system comprising a second cooling loop. A main coolant source, such as a facility cooling fluid is coupled to a condenser unit of the two-phase cooling system. A branch off of the facility cooling fluid is directed to the single-phase cooling loop. The coolant flow to the single-phase cooling loop is controlled by a flow control value and a coolant pump. The facility cooling fluid is managed between the single-phase loop and phase change loop. A rack management unit in the electronic rack controls facility cooling fluid flow rate using the flow control device and pump.

A design for servers and racks, includes a supply connector module including a supply connector connected to a first holder to connect a supply line connector, and a supply switch to engage the first holder when in a first position and to disengage with the second holder when in a second position, the second holder has a shape to disengage the supply switch and disconnect the supply connector from the supply line after a first time interval. The design further includes a return connector module a return connector connected to a second holder to connect a return line connector, and a return switch to engage the second holder when in a first position and to disengage when in a second position, the fourth holder has a shape to disengage the return switch and disconnect the return connector from the return line after a second time interval.

A device including a microchannel heat sink having a first layer circle A and circle B fins and a second layer circle A and circle B fins, wherein circle A fins includes a plurality of outer ring fins and circle B fins includes a plurality of inner ring fins; a cover assembly, in which the cover assembly includes adaptors, a liquid channel, a vapor channel, and a TRV chamber; a thermal regulation valve (TRV), wherein the thermal regulation valve (TRV) is configured to enable dynamic responses for temperature control in the microchannel heat sink; and a temperature sensing mechanism, in which the temperature sensing mechanism is configured to be operable for detecting temperature variations and converting the temperature variations to pressure variations.

Thermal monitoring and analysis of conditions in a power electronic system include sensing of thermal parameters of interest, such as temperature and humidity in an enclosure housing power electronic components. The components are cooled by a liquid coolant flow from a chiller through chiller plates associated with the power electronic components. Air is circulated through the enclosure for heat rejection from the chiller plates. Based on the sensed parameters, factors such as relative humidity and dew point of the cooling air may be computed and evaluated to determine the potential for condensation. Alarms, notices, or recommendations may be output for regulation of the chiller to avoid condensation. The system may also provide for evaluation of installation errors, and degradation of performance over time.

Embodiments are disclosed of an apparatus including a utility section adapted to be positioned in a server chassis and coupled to an electronics section in the server chassis. The utility section includes a power board, a fluid handling module, a fan module electrically coupled to the power board, or both the fluid handling module and the fan module. An external power interface is adapted to electrically couple the power board to a rack power source and an internal power interface is adapted to electrically coupled the power board to one or more servers in an electronic section within the chassis. An external fluid interface is adapted to fluidly couple the fluid handling module to a rack fluid recirculation loops, and an internal fluid interface is adapted to fluidly couple the fluid handling module to a server fluid inlet and a server fluid outlet of each of the one or more electronics sections.

According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.

An electronic rack includes a rack manifold to be coupled to an external cooling fluid source, including a supply rack manifold and a return rack manifold, wherein the rack manifold includes a plurality of pairs of rack connectors disposed thereon. The electronic rack further includes a server chassis including a connector holder having a pair of a supply server connector and a return server connector to be connected with a corresponding pair of rack connectors of the rack manifold. The electronic rack further includes a controller, in response to detecting a leakage of the cooling fluid, configured to cause the supply server connector to disconnect from the supply rack manifold, while maintaining the return server connector connected with the return rack manifold, and to increase a flowrate of the cooling fluid on the return rack manifold to remove the cooling fluid residing within the server chassis.