An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side of the interposer, where the first side of the interposer includes first bond pads coupled to first bond pads of the first IC chip, and the second side of the interposer includes second bond pads coupled to first bond pads of the second IC chip. In an embodiment of the present description, a liquid cooled three-dimensional IC (3DIC) package may be formed with the IC package, where at least two IC devices may be stacked with a liquid cooled interposer. In a further embodiment, the liquid cooled 3DIC package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

A liquid manifold can be assembled to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The manifold can include a plurality of sections, each of the plurality of sections having one or more shut-off valves. One or more leak detection sensors can be arranged to detect leaks in any of the sections and in any of the IT equipment. A controller can control a shut-off valve to a closed position based on a detected leak. The design enables the manifold to better manage and control the fluid for mission critical IT equipment.

A power distribution assembly is disclosed for use with at least one computer in a data centre. The power distribution assembly (11) comprises i) at least one controller (14) comprising at least one heat sensitive component (16) and ii) at least one cooling arrangement (17) comprising a casing (18) configured to contain a coolant (19). At least a portion of the coolant (19) is configured to come into contact with at least part of the controller (14) and/or at least one component for transferring heat away from the at least one controller (14)/component (16) towards at least one wall of the casing (18). This arrangement ensures that even in increased temperature data centres, there is provided consistent and reliable operation of heat sensitive components in smart power strips through dedicated cooling of the components (16).

The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, flow controllers are associated with cold plates and have direct and bypass ports, so that when direct ports are disabled for removal of a first cold plate, bypass ports are enabled to bypass a first cold plate and to enable a second cold plate to be continuously cooled by a datacenter cooling system.

Some embodiments include a thermal management system for a nanosecond pulser. In some embodiments, the thermal management system may include a switch cold plates coupled with switches, a core cold plate coupled with one or more transformers, resistor cold plates coupled with resistors, or tubing coupled with the switch cold plates, the core cold plates, and the resistor cold plates. The thermal management system may include a heat exchanger coupled with the resistor cold plates, the core cold plate, the switch cold plate, and the tubing. The heat exchanger may also be coupled with a facility fluid supply.

Configurations for cooling systems are disclosed. In at least one embodiment, one or more distribution manifolds are formed within at least one panel of a server unit housing to receive a liquid and direct the liquid to one or more outlets, the one or more outlets to couple to one or more cold plates.

A method may include determining whether a fault has occurred in connection with a distribution unit for a fluidic network. The method may also include operating a plurality of three-way valves in a normal mode of operation in absence of the fault, wherein in the normal mode, the coolant fluid flows in parallel through the heat exchanger and the fluidic network. The method may also include operating the plurality of three-way valves in a failure mode in response to the fault, wherein in the failure mode, the coolant fluid flows in serial through the heat exchanger, then the fluidic network.

A method for controlling a cooling system operatively connected to a data processing device for cooling thereof. The method is executed by a controller operatively connected to the cooling system. The method comprises determining, using a machine learning model executed by the controller, an estimated forthcoming power consumption of the data processing device, the machine learning model being based at least in part on a history of power consumption of the data processing device, determining, using a cooling-control model executed by the controller, at least one control signal for controlling the cooling system, determining the at least one control signal being based at least in part on the estimated forthcoming power consumption from the machine learning model, and controlling, by the controller, the cooling system based on the at least one control signal for controlling the cooling system.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an in-row cooling unit is located within a row of racks and between a racks so that it can use an interchangeable heat exchanger (IHE) to receive primary coolant and can use one or more flow controllers to provide a first part of a primary coolant to cool secondary coolant that is to be distributed to at least one cold plate and to provide a second part of a primary coolant to cool air to be circulated through at least one server tray or rack.